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Universal Shows Next-Gen Manufacturing Solutions at APEX 2010

Apr 12, 2010

Universal Instruments poses the following question to electronics manufacturers at IPC APEX 2010: "Is your production system supplier supporting your growth or their own?" With complete process, manufacturing and support solutions for the next generation of production requirements, Universal partners with customers from product concept through the entire product life cycle. On display on Universal's booth #1083 will be the GenesisSC (Semiconductor) Platform. GenesisSC takes full advantage of leading-edge Genesis Platform technologies coupled with high-accuracy enhancements to deliver semiconductor performance at surface mount speeds.

Universal features the industry’s broadest equipment portfolio, including Surface Mount, Through-Hole, Odd Form, Final Assembly, and Semiconductor technologies. Universal not only provides best-in-class production equipment, but is also uniquely qualified to work with manufacturers in every aspect of their products’ life cycles – from applied materials selection, prototype production builds, and factory layout, to applications design and development to deliver solutions with the highest possible flexibility and throughput. With the introduction of the next generation of components and processes, these aspects of production become extremely critical in achieving optimal productivity.

Highly capable equipment is at the core of Universal production solutions. Heinz Dommel, Universal Marketing Director, states, "The current transition to new component packaging types and process requirements has really highlighted the inherent capabilities of the Genesis Platform and VRM linear motor technology." Dommel continued, “By integrating features such as high-resolution optics, thin film fluxing, wafer handling, and specialized software, we were able to evolve the base Genesis Platform into GenesisSC – the fastest flip chip placer on the PRESS RELEASE market with placement down to 10 Micron Cp. GenesisSC is the only platform that can handle the converging assembly needs of our manufacturers, including System-in-Package (SiP), Flip Chip in Package, Flip Chip on Board/Flex, Package-on-Package (PoP), and PQFN applications.”

Knowledge and experience play a vital role in implementing new processes and Universal's Advanced Process Laboratory (APL) has the real world process design and deployment tactics to support this implementation. "From the whiteboard to first article, the APL has the resources to nurture ideas from concept to reality by applying cycles of learning from years of supporting a broad customer base,” commented Dommel. "The APL coupled with our expert applications resources help our customers get their products to market quickly and efficiently".

Universal has both the tools and field expertise to maximize factory efficiency and achieve continuous improvement. Dimensions® line software reports and tracks efficiency, performance, wait times, and more to minimize lost production. Universal’s Global Services provide value-added support through all phases of the ownership experience; from site preparation and startup, to equipment audits and enhancements, to block service contracts and post-warranty support continuance packages.

About Universal Instruments:

Universal Instruments is a global leader in the design and manufacture of advanced automation and assembly equipment solutions for the electronics manufacturing industry. Universal provides complete assembly lines to EMS Providers, ODMs and electronics assemblers around the world, leveraging its portfolio of compatible and flexible equipment platforms that address the diverse requirements of high-speed chip and multifunction placement applications as well as component insertion. Universal Instruments is headquartered in Binghamton, with offices in Europe, Asia, and the Americas.

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