SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Universal Instruments Corporation


Universal’s GenesisSC: Semiconductor Performance at Surface Mount Speeds

Apr 12, 2010

GenesisSC ,  Semiconductor Performance at Surface Mount Speeds.

GenesisSC , Semiconductor Performance at Surface Mount Speeds.

Universal Instruments expands its proven Genesis Platform portfolio with the introduction of the GenesisSC Platform – a revolutionary Semiconductor solution that blends state-of-the-art flip chip assembly capabilities with the robustness and speed of the Genesis Platform.

The GenesisSC Platform has the inherent capability to provide a complete solution for any production environment. This platform has been tailored to place dies and passives precisely while promoting high yields and reliability at the lowest possible cost. "The combination of 300mm wafer capabilities and industry’s fastest flip chip throughput, along with Universal’s standing reputation for robustness, creates an industry-leading value for our customers", states Universal Marketing Director Heinz Dommel.

Because this new Semiconductor technology was developed from Universal’s base Genesis Platform, GenesisSC is able to leverage patented VRM (Variable Reluctance Motor) technology, which is the core of all Universal platforms. When coupled with Universal’s high-precision multi-spindle placement heads, it delivers a one-of-a-kind high-accuracy product offering with placement capabilities down to ±10 micron @ Cp>1. The GenesisSC Platform software has also been enhanced to feature greater ease of use to support Semiconductor applications.

"The higher-accuracy capabilities allow Universal to solve specialized packaging challenges" states Dommel. "By specifically targeting specialty areas such as System-in-Package (SiP), Flip Chip, and Flip Chip on Flex, GenesisSC provides the optimal solution to our customers." These specialized competencies do not come at the expense of flexibility, however, as GenesisSC maintains the Genesis lineage with a best-in-class component range from passives to SM devices.

Universal's unique peripherals further strengthen the complete, integrated Semiconductor solution. When combined with the Innova Direct Die Feeder, the new solution drastically reduces resource allocation and costs by directly presenting die from 300mm wafers to the platform machine without incurring costly packaging charges. The on-board Linear Thin Film Applicator (LTFA) provides dipping capabilities for paste or flux, as commonly associated with PQFN and Package-on-Package applications, and the 0.4 mil per pixel camera captures details of the most difficult substrate and fiducial types.

You must be a registered user to talk back to us.

More News from Universal Instruments Corporation

Jul 21, 2016 -

Universal Appoints Jeff Knight General Manager,  APL and Advanced Technology Assembly Services

Feb 18, 2016 -

EEI Manufacturing Services Selects Universal Instruments' Fuzion Platform Versatile solution meets critical flexible production requirements for multi-million dollar contract.

Nov 14, 2015 -

Universal's APL to Deliver Technical Session at LED A.R.T. Symposium

Nov 01, 2015 -

Universal Features Surface Mount and Automation Solutions at Productronica 2015

May 07, 2015 -

Universal Fortifies Americas Operations, Appoints Michael Welch Regional Manager

Apr 01, 2015 -

Universal Appoints New Channel Partner in Brazil

Mar 16, 2015 -

Universal's Custom Tooling Paying Dividends for SEL

Dec 02, 2013 -

Universal's Fuzion Platform Awarded at Productronica

Dec 09, 2012 -

Universal Improves Spare Parts Website, Hires General Manager of Production Tooling

Nov 29, 2012 -

Universal Instruments’ APL Holds AREA Consortium Meeting

(45) more news from Universal Instruments Corporation

Universal’s GenesisSC: Semiconductor Performance at Surface Mount Speeds news release has been viewed 822 times

PCB machines

Manufacturing Software