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FCT Assembly’s NC160 Lead-Free Flux Wins a 2010 NPI Award

Apr 11, 2010

GREELEY, CO — FCT Assembly announces that it has been awarded an NPI Award in the category of Flux for its NC160 lead-free flux. The award was presented to the company during a Tuesday, April 6, 2010 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas during APEX 2010.

FCT Assembly’s NC160 lead-free flux is a no-clean activated material for wave soldering through-hole, mixed and surface mount assemblies. FCT developed the no-clean flux to be used with both SAC and SN100c Alloys. The flux is specifically made to wet all surface finishes and give good top-side wetting.

NC160 no-clean flux is compatible with all existing lead-free alloys. The flux was developed to be utilized with all lead-free alloys used in the electronics market, and is formulated to work with FCT Assembly’s SN100C Bar Solder. NC160 eliminates solder balls, while providing excellent solderability with minimal flux residue so that cleaning is not necessary.

With an increased amount of solids, NC160 offers more flexibility than most no-clean fluxes. It also has been formulated to work with OSP coated boards, offering flexibility to the end user, as they can utilize boards with OSP, Ni/Au, Ag and lead-free SN100c HAL.

NC160 provides excellent wetting on all surface finish boards, leaving a cosmetically appealing solder joint. The lead-free flux is formulated for foam, spray, wave or dip applications. It is also suitable for conventional, mixed, and surface mount technologies for telecommunications, computer and general consumer electronics.

Premiering in 2008, the NPI Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

About FCT Assembly

FCT Assembly was created after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder (both conventional 63/37 and SN100C® lead-free) bar. The assembly products are manufactured in the Greeley, Colo. plant and the stencils are manufactured in the Beaverton, Ore., Memphis, Tenn., and Greeley, Colo. facilities. The stencils can be fabricated by both laser cutting and chemical etch. The company also makes precision parts in its A-Laser division, which is located in Beaverton, Ore. For more information, visit

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