The three board officers are:
Chairman of the Board — Bob Ferguson, president, Interconnect Technologies, Dow Electronic Materials, Shanghai, China. Ferguson has been on the IPC Board of Directors since 2005. He participated on numerous IPC committees, chaired the IPC Printed Circuits Expo® Tradeshow Subcommittee and was vice chair of the IPC PCB Suppliers Council. He served as IPC Board vice chairman 2008–2010.
Vice Chairman — Steve Pudles, CEO, API Technologies Corp., Ronkonkoma, N.Y. Pudles was a founding member of the Assembly Market Research Council Steering Committee, chairs the EMS Management Council and previously chaired the IPC task group that created the IPC-D-326 standard on documentation requirements for printed circuit assemblies. He has been a member of the Board since 2000 and served as secretary/treasurer 2008–2010.
Secretary/Treasurer — Don Schroeder, executive vice president and general manager of electronic components, CTS Corporation, Bloomingdale, Ill. Schroeder has extensive international business experience and currently has responsibility for operations in North America and Asia. He chairs the Executive Market & Technology Steering Committee. Schroeder was elected to his first term on the Board in 2006.
The three board directors are:
Andy Hyatt, executive vice president for business development, Creation Technologies, Burnaby, BC, Canada. Hyatt has spent 20 years in the EMS market, having held various operations, program management and business development roles with Tier 1, 2 and 3 EMS companies, including Plexus, Solectron, Viasystems and EFTC. Hyatt is a member of the IPC Executive Market & Technology Steering Committee and is a frequent speaker at its conferences.
Dongkai Shangguan, Ph.D., IEEE Fellow, vice president, Flextronics, San Jose, Calif. Dr. Shangguan is an active member of IPC committees on electronics assembly, materials declaration, photovoltaics and chip carriers. He received the IPC President’s Award in 2006. He has been a member of the IPC APEX EXPO program committee, has spoken at IPC international technical conferences and contributed research for IPC’s lead-free solder test program. He is responsible for advanced technologies and engineering leadership at Flextronics.
Mikel Williams, president and CEO, DDi Corporation, Anaheim, Calif. Before joining DDi, Williams served as president of Constellation Management Group, LLC, where he provided strategic, operational and financial consulting services. He began his career as a certified public accountant as an auditor for PricewaterhouseCoopers. He has been a member of the IPC Executive Agent Task Force since its inception and is the incoming chair of the IPC Government Relations Committee.
In addition to the Board election, IPC presented Corporate Recognition, President’s, and Raymond E. Pritchard Hall of Fame Awards during its Annual Meeting. For additional information regarding IPC’s Board of Directors, contact Anna Garrido, IPC director of marketing and communications, at +1 847-597-2804.
IPC (www.IPC.org) is a global trade association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 2,700 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $1.7 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Garden Grove, Calif.; Stockholm, Sweden; Moscow, Russia; and Shanghai and Shenzhen, China.