SMT, PCB Electronics Industry News

STI Electronics' Casey Cooper to Present at APEX 2010

Mar 30, 2010

Casey H. Cooper, Electrical Engineering Manager.

Casey H. Cooper, Electrical Engineering Manager.

MADISON, AL - STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Casey H. Cooper, Electrical Engineering Manager will present a paper titled "Embedded Packaging Technologies: Imbedding Components to Meet Form, Fit, and Function" at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas. The presentation will be held during Session S20, titled "Emerging Technology II: Embedded Actives," which will take place Wednesday, April 7, 2010 from 10:15- 11:45 a.m.

As the electronics industry moves toward smaller form and fit factors, advanced packaging technologies are needed to achieve these challenging design requirements. Current design problems are not driven by circuit design capabilities, but by an inability to reliably package these circuits within the space constraints. Innovative packaging techniques are required in order to meet the increasing size, weight, power, and reliability requirements of the industry without sacrificing electrical, mechanical, or thermal performance.

Emerging technologies, such as those imbedding components within organic substrates, have proven capable of meeting and exceeding these design objectives. Imbedded Component/Die Technology (IC/DT®) addresses these design challenges through imbedding both actives and passives into cavities within a multi-layer printed circuit board (PCB) to decrease the surface area required to implement the circuit design and increase the robustness of the overall assembly. A passive thermal management approach is implemented with an integrated thermal core imbedded within the multi-layer PCB to which high power components are mounted directly.

This paper discusses the design methodology, packaging processes, and technology demonstrations of prototypes packaged using this technology. The various prototypes designed and manufactured using this technology will be presented.

About STI Electronics, Inc.

Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly in the electronics industry. STI also produces a complete line of solder training kits and training support products. Additionally, the company distributes products for the electronics and industrial markets. For more information, visit http://www.stielectronicsinc.com.

Aug 29, 2017 -

STI Recognizes Ann Duncan’s 20-Year Anniversary

Aug 14, 2017 -

STI Electronics to Exhibit at SMTA International

Aug 01, 2017 -

Leadership Huntsville/Madison County Selects Diana Bradford for Management Academy

Jul 19, 2017 -

STI Acquires Fischerscope X-ray XDAL 237

Jun 20, 2017 -

In Memory of Jim D. Raby, PE

Jun 08, 2017 -

STI Recognizes Michelle Morring’s 10-Year Anniversary

May 15, 2017 -

STI Electronics to Showcase Specialized Contract Manufacturing Services at the 2017FLEX Conference

Mar 15, 2017 -

STI Electronics to Exhibit at Local SMTA Huntsville Expo

Feb 28, 2017 -

STI Electronics Announces Participation in AUSA Global Force Symposium and Exhibition

Feb 23, 2017 -

STI Electronics Goes to SMTA Houston Expo to Discuss Training Services/Training Materials/Engineering Services

211 more news from STI Electronics »

Oct 19, 2017 -

Logic PD to Exhibit Medical Market Successes at MD&M Minneapolis 2017

Oct 18, 2017 -

Horizon Sales Earns Juki Sales Awards

Oct 18, 2017 -

MarTec Receives Outstanding Achievement Award from Juki Automation Systems

Oct 18, 2017 -

Engineered Material Systems Introduces New UV-Cured Adhesive for Bonding Lens Holders in Camera Modules

Oct 18, 2017 -

Keith Bryant to Present on Behalf of YXLON International at productronica

Oct 18, 2017 -

Metcal makes strategic move in industrial ingenuity – Learn more at productronica

Oct 18, 2017 -

Sono-Tek to Introduce New SelectaFlux-A System at productronica 2017

Oct 18, 2017 -

Aegis Software Brings “The Smarter Perspective” on Industry 4.0 MES Technology to Productronica

Oct 18, 2017 -

IPC Hand Soldering Competition Winner Crowned at IFTEC in Paris

Oct 18, 2017 -

Data I/O to Showcase SentriX™Security Provisioning Technology and ConneXTM Smart Programming Software for Automotive Applications and Smart Factory Initiatives at productronica

See electronics manufacturing industry news »

STI Electronics' Casey Cooper to Present at APEX 2010 news release has been viewed 847 times

HeatShield Gel- thermal PCB shield during reflow

pcb components vacuum pick up