SMT, PCB Electronics Industry News

STI Electronics' Casey Cooper to Present at APEX 2010

Mar 30, 2010

Casey H. Cooper, Electrical Engineering Manager.

Casey H. Cooper, Electrical Engineering Manager.

MADISON, AL - STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Casey H. Cooper, Electrical Engineering Manager will present a paper titled "Embedded Packaging Technologies: Imbedding Components to Meet Form, Fit, and Function" at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas. The presentation will be held during Session S20, titled "Emerging Technology II: Embedded Actives," which will take place Wednesday, April 7, 2010 from 10:15- 11:45 a.m.

As the electronics industry moves toward smaller form and fit factors, advanced packaging technologies are needed to achieve these challenging design requirements. Current design problems are not driven by circuit design capabilities, but by an inability to reliably package these circuits within the space constraints. Innovative packaging techniques are required in order to meet the increasing size, weight, power, and reliability requirements of the industry without sacrificing electrical, mechanical, or thermal performance.

Emerging technologies, such as those imbedding components within organic substrates, have proven capable of meeting and exceeding these design objectives. Imbedded Component/Die Technology (IC/DT®) addresses these design challenges through imbedding both actives and passives into cavities within a multi-layer printed circuit board (PCB) to decrease the surface area required to implement the circuit design and increase the robustness of the overall assembly. A passive thermal management approach is implemented with an integrated thermal core imbedded within the multi-layer PCB to which high power components are mounted directly.

This paper discusses the design methodology, packaging processes, and technology demonstrations of prototypes packaged using this technology. The various prototypes designed and manufactured using this technology will be presented.

About STI Electronics, Inc.

Since 1982, STI Electronics, Inc. (STI) has been the premier full service organization for training, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly in the electronics industry. STI also produces a complete line of solder training kits and training support products. Additionally, the company distributes products for the electronics and industrial markets. For more information, visit http://www.stielectronicsinc.com.

Mar 26, 2024 -

STI Welcomes Edrick Young as the Newest Mechanical Assembly Technician

Mar 11, 2024 -

STI Electronics, Inc. to Showcase Cutting-Edge Solutions at the Dallas SMTA Expo & Tech Forum and Houston Chapter Expo

Mar 11, 2024 -

STI Welcomes Jason Appleton as the Newest Master Instructor

Feb 19, 2024 -

STI Introduces Engineering Intern Kylie Clark: A Rising Star in Innovation

Feb 12, 2024 -

STI Recognizes Jeff Light's 10-Year Anniversary

Jan 29, 2024 -

STI Recognizes Bobby Inman's 15-Year Anniversary

Jan 15, 2024 -

STI Recognizes Lisa Hammonds' 10-Year Anniversary

Dec 18, 2023 -

STI Electronics, Inc. Adds Jenny Taymon to Its Training Services Team

Dec 11, 2023 -

STI Electronics' Mark McMeen Chosen as Panelist for Joint Defense Manufacturing Technology Panel

Aug 07, 2023 -

STI Electronics, Inc. Welcomes Nika Bailey as Quality Control Technician

300 more news from STI Electronics »

Mar 27, 2024 -

Red Glue SMT Solutions: A Cost-Effective Approach for Double-Sided PCBs

Mar 26, 2024 -

North American PCB Industry Sales Down 11.6 Percent in February

Mar 26, 2024 -

iNEMI/IPC White Paper on Complex Integrated Systems Highlights Future Technology and Manufacturing Ecosystem Needs

Mar 26, 2024 -

Don Dennison Appointed to Roll Out KIC's Latest Thermal Analysis System Software in the Northeast

Mar 26, 2024 -

Altus Group Achieves Record Sales Milestone with Koh Young Europe

Mar 26, 2024 -

STI Welcomes Edrick Young as the Newest Mechanical Assembly Technician

Mar 26, 2024 -

Anda Technologies Receives 2024 NPI Award for Setting a New Standard in Smart Manufacturing

Mar 26, 2024 -

ZESTRON's Olaf Schoenfeld, Ph.D. to Participate in EV Special Session at IPC APEX Expo

Mar 26, 2024 -

North American EMS Industry Up 4.1 Percent in February

Mar 26, 2024 -

SMTA Europe Announces 2024 Spring Conferences

See electronics manufacturing industry news »

STI Electronics' Casey Cooper to Present at APEX 2010 news release has been viewed 770 times

SMT fluid dispensing