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FINE LINE STENCIL to Highlight Stencils and Services at APEX 2010

Mar 30, 2010

COLORADO SPRINGS, CO - FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, to feature industry leading stencils and services in booth 2317 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.

The UltraSlic™ FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic™ FG outperforms all existing stencil technologies on the market today. Using the latest stencil laser technology and Datum Alloys' new Fine Grain stencil material, exclusively distributed by Ed Fagan, Inc., UltraSlic™ FG stencils provide superior aperture registration, higher performance and lower cost compared to electroform, the option of step stencils, and the option of same day turnaround times.

In addition to its stencils, FINE LINE sells a stencil experience that is unmatched in today’s market. FINE LINE STENCIL’s engineering group provides Root Cause Analysis, solving difficult printing issues. With its facility in Memphis, FINE LINE is able to offer same day service to its customers as late as 7 p.m. Additionally, with the company’s online tracking system, users easily can place orders and track shipments online. For additional information, please contact Derek Stuart at (719) 579-8055 x111 or visit

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