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CyberOptics to Expand Product Portfolio with New SPI and AOI System at APEX 2010

Mar 27, 2010

MINNEAPOLIS - CyberOptics Corporation (Nasdaq: CYBE) announces that it will introduce its newest SPI and AOI systems in booth 2271 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.

SE350 ™ is the latest addition to CyberOptics’ 3-D solder paste inspection system portfolio. The simple and robust SE350 design with CyberOptics calibration-free sensor technology offers the lowest cost of ownership in the industry with zero machine-to-machine variation across the production lines. Leveraging on the technology of SE500, this system is capable of inspecting pad sizes down to 01005 component size (150 x 150 ?m).

The AOI QX500 combines a unique image acquisition solution to provide yet another industry-leading, high-speed inspection solution. The QX500 represents a quantum leap in inspection technology, system design and speed, with improved cycle times. The introduction of SIM enables the system to offer ‘on-the-fly’ inspection, setting it apart from conventional inspection methods.

The team at CyberOptics is excited and looking forward to demonstrating the technology innovations behind these two systems at booth 2271.

About CyberOptics Corporation

Founded in 1984, CyberOptics is a recognized leader in process yield and throughput improvement solutions for the global electronics assembly and semiconductor capital equipment markets. Headquartered in Minneapolis, MN, CyberOptics conducts operations in North America, Asia and Europe. For more information, visit the company's Web site at http://www.cyberoptics.com.

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