SMT, PCB Electronics Industry News

FINETECH to Debut Core Rework System at APEX 2010

Mar 24, 2010

FINEPLACER Core rework system

FINEPLACER Core rework system

FINETECH will debut the new FINEPLACER Core rework system in booth #2329 at the upcoming IPC/APEX exhibition, scheduled for April 6-8, 2010 at the Mandalay Bay Convention Center in Las Vegas, NV.

The FINEPLACER Core offers proven rework technology for a wide spectrum of SMT components, ranging in size from 0201 to 50 x 50 mm BGAs, and handling PCBs up to 300 x 400 mm. The semi-automated design includes force measurement with automatic component lift off and placement. Based on key technology from FINETECH‘s industry leading platforms, the Core represents a compact, yet versatile hot-gas rework system that will provide a level of professionalism exceeding its attractive price.

The system integrates the complete rework cycle into an efficient design, without diminishing functionality. Using the FINEPLACER fixed vision alignment system, the Core handles de-soldering, site dressing, paste print, re-balling and component replacement in one integrated platform. Driven by sophisticated integrated thermal management and the new QuickStart Profile Library, the new Core provides more for less.

About FINETECH

FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China; and Penang, Malaysia.

Apr 07, 2016 -

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 10, 2012 -

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

76 more news from Finetech »

Apr 25, 2018 -

KYZEN Wins EM Asia Innovation Award for ANALYST Data Services Platform

Apr 25, 2018 -

PDR Enters Reps Agreement with Restronics

Apr 25, 2018 -

PACE Worldwide Appoints Neil Manson as European Regional Sales Manager

Apr 25, 2018 -

Dr. Mike Bixenman to Present at the SMTA Medical Electronics Symposium

Apr 25, 2018 -

ZESTRON Taiwan Inauguration

Apr 25, 2018 -

SHENMAO Technology to Exhibit New Solder Alloy with High Thermal & Impact Reliability at SEMICON Southeast Asia

Apr 25, 2018 -

Press preview for Seica SpA participation at SMT, Nuremberg, June 5-7 – 17 2018, Hall 5, Booth 220, Exhibition center, Nuremberg.

Apr 25, 2018 -

Metcal Receives 2018 SMT China Vision Award

Apr 25, 2018 -

Techcon Releases TSR2000 Series Smart Dispensing Robots

Apr 25, 2018 -

Koh Young Technology to highlight Next-generation Premium 3D AOI at NEPCON China 2018

See electronics manufacturing industry news »

FINETECH to Debut Core Rework System at APEX 2010 news release has been viewed 1159 times

TWEEZER-VAC ELITE Vacuum SMD Tweezer Kit

Metcal soldering rework