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KIC to Introduce Groundbreaking Profiling Study at APEX 2010

Mar 24, 2010

San Diego - March 2010 — KIC, the leader of thermal process development and control products, and winner of multiple industry awards, will share the latest science and products for reliable nondestructive methods of profiling in booth #1549 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas, NV.

KIC and the Rochester Institute of Technology have completed a groundbreaking study in the field of thermocouple attachment that explores methods of creating offsets in place of drilling holes and other destructive means for high interest components, such as BGAs. Additionally, hard science on the best attachment method of thermocouple attachment is also covered in this report. Be sure to request a copy of this report, as well as explore some of the hardware and software options currently on the market for non-destructive profiling.

Also, do not forget to stop by the booth to take a shot at KIC's man vs. machine game and beat KIC's auto-prediction Navigator for a chance to win prizes, including the new Apple iPad.

Based in San Diego, KIC is the industry leader in automated thermal management tools and systems for reflow, wave, cure and semiconductor thermal processes. The company pioneered the development of oven profilers and process development tools, and then worked to create the next generation of thermal systems to help manufacturers optimize and monitor thermal processes.

In addition to KIC Explorer, products include the KIC 24/7 continuous monitoring system, the KIC Vision automatic profiling system and more. With the introduction of cutting edge tools, the company continues to stay on the leading edge of process optimization and real-time thermal management systems, and has won numerous industry awards.

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