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MARTIN to Demonstrate Compact, Stand-alone BGA Reball Unit at APEX 2010

Mar 24, 2010

Reball 03.1 compact, stand-alone BGA reball unit.

Reball 03.1 compact, stand-alone BGA reball unit.

MARTIN, a FINETECH company, will demonstrate the Reball 03.1 unit in booth #638 at the upcoming IPC/APEX exhibition, scheduled for April 6-8, 2010 at the Mandalay Bay Convention Center in Las Vegas, NV.

The Reball 03.1 is a cost effective, stand-alone reballing unit, capable of handling a diverse range of BGAs, as well as QFNs and CSPs.   Processes can be completed in as little as three minutes.  The simple Rapid Technology soldering profiles rigorously apply settings within the permitted thermal limits, heat at the highest advisable thermal ramp rates, and maintain within a safe temperature zone.

The Reball-03.1 consists of a control unit, BGA holder and frame set for different components. The accessories kit includes solder balls, flux pen, solder paste, hook, brush, tape, cutter and magnifier.

For further information please see http://www.martin-smt.de.

MARTIN has developed hand soldering, affordable rework and dispensing technologies for 27 years. The USA sales and service office is located in Manchester, NH. The company‘s manufacturing facility is in Wesseling, Germany. MARTIN is a FINETECH company which produces advanced rework and bonding platforms for complex applications.

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