SMT, PCB Electronics Industry News

Vi TECHNOLOGY Inc. signs partnership with Lewis & Clark

Mar 22, 2010

Richardson, USA, 2010, March 18th - Vi TECHNOLOGY Inc. announced, the signature of a partnership with the American based Company Lewis & Clark, leader in selling and servicing SMT second hand equipments.

Lewis & Clark and Vi TECHNOLOGY have signed a partnership to extend their product offerings. On one end, Lewis & Clark is becoming Vi TECHNOLOGY Licensed Service Partner for Americas and will be able to serve all Vi TECHNOLOGY AOI and SPI equipments from installation, basic operations to advanced support. On the other end, Vi TECHNOLOGY is integrating the unique Lewis & Clark experience of trading used equipment as new solution for customers.

Adding Lewis & Clark as Licensed Service Partner extends Support and Service capabilities of Vi TECHNOLOGY through Americas. Lewis & Clark team, with an average of more than 10 years experience in SMT Industry, is located in all strategic area providing local presence to Vi TECHNOLOGY customers.

“This partnership seals a long term collaboration between both companies”, explained Jean-Marc Peallat, Vi TECHNOLOGY Inc. CEO, “with the objective to improve customer proximity without compromising on service quality and offer more creative solutions to our customers”.

Lewis & Clark is leading the used equipment market offering a wide range of product abroad SMT manufacturing lines. Lewis & Clark has made its reputation by providing first class service and expertise to customers.

"Lewis & Clark is excited about the partnership with Vi TECHNOLOGY here in North America. Our goal is to give Vi TECHNOLOGYs customers timely service as well as the opportunity to trade in un-used assets toward new VIT equipment." Says Frank L. Clark, Jr., President/ CEO

About Vi TECHNOLOGY

Vi TECHNOLOGY is a worldwide global supplier in designing, manufacturing, and supporting a wide range of innovative Automated Optical Inspection equipment and software solutions for a broad range of applications. These applications include PCB assembly, back-end semiconductor production, incoming inspection and process control.

Our goal is to create value to customers by developing technologies answering to the evolution of our common market. Our R&D program is focusing on enhancing existing products as well as bringing technological breakthrough to reach a sustainable excellence. Our customers’ market differentiation is a key issue. Each of our clients is different and we must be able to growth in their differentiation.

With 15 years of experience, our offering is adapted to the most demanding requirements of in terms of accuracy, repeatability, speed, and quality. We confirm our leadership in the AOI market and we propose turnkey solutions to maximize the Return-On-Investment and decrease the cost-of-ownership in manufacturing plants. A world-class level of service supports our equipment with fast response time through our 24-hour hotline. We also offer a strong network of 200 fully trained Agents and Distributors to ensure quick relay of issues to our offices.

We serve a large number of customers including the Number 1 player in the automotive electronics market, the Number 1 contract electronics manufacturer, and the Number 1 player in the mobile phone industry.

Our mission is to serve our customers worldwide to reach our Total Customer Satisfaction goals.

Further information on Vi TECHNOLOGY is available at http://www.vitechnology.com.

About Lewis & Clark

Lewis & Clark is a world leader in the purchasing, refurbishment, sales and service of used SMT manufacturing and test equipment. For over 20 years, our Global team has provided quality field service for the test, inspection, and SMT feeder markets. Lewis & Clark has returned high market values for our clients seeking to liquidate entire factories or individual pieces of equipment. We are consistently looking for strong OEM partnerships to bring even greater value to the used equipment industry and to aid in the growth of the new equipment sector as well.

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