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News from Henkel Electronic Materials


Henkel to Show Latest Materials Innovations at APEX 2010

Mar 17, 2010

Multicore LF620 - lead-free, no-clean solder paste.

Multicore LF620 - lead-free, no-clean solder paste.

Customers visiting Henkel at the upcoming APEX 2010 event in Las Vegas will quickly discover that partnering with the materials leader is no gamble. A continued emphasis on product innovation and R&D investment – even throughout the recent downturn – has placed the company firmly at the top among electronics materials suppliers, with materials solutions and global resources that are unmatched.

From booth #2159 at this year’s APEX, Henkel will display several new technologies including the latest in its halogen-free portfolio: Multicore HF108. The material is a lead-free, halogen-free solder paste that delivers all of the benefits of high-performance lead-free solder pastes with the added advantage of zero deliberately added halogens, which puts it under the limit of detection in the rigorous oxygen bomb/ion chromatography test. Multicore HF108 has been formulated for low voiding in fine-pitch BGAs and CSPs with proven capability over a wide range of surface finishes including Immersion silver and OSP copper. Excellent coalescence even after eight hours of exposure to 80% relative humidity (RH), colorless residues for speed and ease of post-print inspection and good slump resistance are all performance attributes of Multicore HF108.

Also part of the Multicore portfolio is Henkel’s leading lead-free solder paste material, Multicore LF620. During the show, this robust, high-performance paste will be demonstrated on-board DEK’s Horizon 03iX print platform. Live print demonstrations will take place April 6 through April 8 from 2:00 pm to 3:00 pm. Both Henkel materials specialists and DEK solutions engineering staff will be on-hand to discuss specific process requirements.

In addition to live printing demonstrations, the Henkel booth will also host Cavist’s Moldman™ system, which processes Henkel’s well-known Macromelt low-pressure molding material to encapsulate circuitry. For certain applications, Macromelt technology can eliminate messy potting processes and allows for circuitry protection and the formation of the product’s outer shell – all in one simple step. On-demand demonstrations will take place throughout the 3-day APEX event.

Henkel’s APEX display will also include PowerstrateXtreme – Printable (PSX-P), a printable phase change thermal interface material that allows for precise thickness control and automated processing via a stencil printing process. The relevance of the novel thermal management material and its industry benefit has also been affirmed by industry experts, as PSX-P was selected as one of the key technologies for show host IPC’s Innovative Technology Center. As part of this honor, PSX-P will be featured in a technology display located at the entrance to the APEX exhibit hall.

Henkel invites APEX attendees to visit booth #2159 to find out about the company’s latest technology advances and discuss how Henkel can address specific process requirements. For more information or to schedule an appointment with Henkel technical staff, please call 1-888-9-Henkel.

Except as otherwise noted, all marks used herewith are trademarks and/or registered trademarks of Henkel and/or its affiliates in the US and elsewhere.

About Henkel

Henkel has been committed to making people's lives easier, better and more beautiful for more than 130 years. A Fortune Global 500 and Germany's most admired company according to a recent Fortune survey, Henkel offers strong brands and technologies in three areas of competence: Home Care, Personal Care and Adhesive Technologies. Each day, more than 50,000 employees worldwide are dedicated to fulfilling Henkel's claim "A Brand like a Friend”. In fiscal 2009, Henkel generated sales of 13,573 million euros and adjusted operating profit of 1,364 million euros

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