SMT, PCB Electronics Industry News

SMTA International Call for Papers

Feb 17, 2010

The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.

Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. Materials should be original, unpublished and non-commercial in nature.

Abstracts Due: March 5, 2010 | Acceptance: May 20, 2010 | Manuscripts Due: July 16, 2010

Papers are being solicited in the following categories:

Emerging Technologies: 0201/01005 Components and Assembly, Consumer Applications, Electronic Printing Technology, Embedded Technology / Actives and Assembly, Flexible Electronics, MEMS/RF, MEMS/MOEMS, Nanoelectronics, Reliability of Nanodevices, New Materials and Processes, Optoelectronics, Power or Thermal Management, Sensors and Manufacturing, Solar Technology, System in a Package, Thermal Interface Materials, and Wireless Applications including Bluetooth and Wi-Fi

Components: BGA, Battery Interactions, BTCs (Bottom Termination Components), CSP (including Wafer-Level Packages), Component Solderability, Component Reliability, Connectors, Embedded Passives, Failure Analysis, Fine Pitch Technology, Flip Chip / Direct Chip Attach, Lead/Termination Finish, Leadless Packaging, Multichip Packages (including 3-D Packaging, Package on Package), and Tin Whiskers.

Assembly: Adhesives, Alternate Alloys, BGA/CSP Assembly, Cleaning, Connector Technology, Copper Erosion, DFX/Design for Six Sigma, Dispensing, Equipment Selection, Facility Layout, Flux and Solder, Halogen and Halogen-Free, Head-in-Pillow Defect, Land Pattern Design, Lead-Free Soldering (including case studies), Lead-Free Reliability, Lean Manufacturing, Low Volume / Prototype Assembly, Medical Electronics, Placement, Printing, Reflow Soldering, Rework and Repair of QFNs, RFID Assembly, Selective Soldering, Set Up Reduction, Solder Paste, Solder Voids, Supplier Engineering, Underfill, Vapor Phase Reflow for High Reliability Assemblies, Wave Soldering, Yield Improvement.

PCB Technology: Black Pad and Surface Finish Defects, Embedded Passive and Active Components, Halogen Free, HDI, Microvias (including filled and unfilled), Moisture Sensitivity, Soldermask, Substrate Reliability, Substrate Solderability, Surface Finish.

Process Control: Acoustic Imaging, AOI, CIM, In-Circuit Test, Process Modeling, Software, Test Strategies, X-Ray.

Harsh Environment Applications: Components and Component Reliability, Lead-free Issues for Harsh Environments, Substrates, and Thermal Management.

Business: Capacity Modeling, Contract Manufacturing, Doing Business in Asia, Environmental Issues, Lean Manufacturing / Quality Initiatives, Operations Management, Remaining Competitive, RoHS Compliance, Supplier Management, Technology Roadmaps.

Jun 20, 2017 -

SMTA Launches New Partnership with Thayer School of Engineering at Dartmouth College

Jun 08, 2017 -

SMTA International Conference Program Finalized and Registration Now Open

May 30, 2017 -

SMTA and CALCE Seeking Abstracts for 3rd Annual LED Assembly, Reliability, and Test Symposium

May 23, 2017 -

SMTA, iNEMI, MEPTEC Seek Presenters for 2018 Medical Electronics Symposium

May 15, 2017 -

SMTA China Presents Seven Best Paper/Best Presentation Awards and Two Best Exhibit Awards at SMTA China East Conference 2017/NEPCON China 2017

Apr 26, 2017 -

SMTA/CALCE Announce Program for Symposium on Counterfeit Parts and Materials

Apr 11, 2017 -

IBM and Siemens Experts to Keynote Contamination, Cleaning and Coating Conference

Apr 07, 2017 -

The SMTA Capital Chapter to Host a Meeting April 25th at ZESTRON Americas

Mar 15, 2017 -

Contamination, Cleaning and Coating Conference Program Finalized

Feb 05, 2017 -

SMTA Announces 2017 Educational Programming

547 more news from Surface Mount Technology Association (SMTA) »

Jun 25, 2017 -

Libra Industries’ Christopher R. Howell Memorial Foundation Awards $20,000 in Scholarships during Annual Golf Outing

Jun 25, 2017 -

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

Jun 25, 2017 -

Ersa Brings the ‘Little Big One’ to SMTA Ohio – Award-Winning Selective Solder

Jun 25, 2017 -

Optimal Electronics Releases Process Control and Traceability Solution for Nordson ASYMTEK Applications in Clean Rooms for Sensor Assembly

Jun 25, 2017 -

Inovaxe Partners with Repstronics in Mexico

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

Jun 21, 2017 -

PNC Inc. Launches Design Webinar Series

See electronics manufacturing industry news »

SMTA International Call for Papers news release has been viewed 801 times

PCB machines

How FactoryLogix Helped Sparton Corp. Achieve Regulatory Compliance