SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Finetech


ECT’s CPG TO FEATURE SEMICONDUCTOR PROBES AT BiTS 2010

Feb 11, 2010

Pomona, CA, February 2010 — Everett Charles Technologies (ECT) Contact Products Group (CPG) will feature the latest semiconductor probes at the upcoming Burn-in & Test Socket Workshop, scheduled to take place March 7-10, 2010 at the Hilton Phoenix East/Mesa Hotel in Mesa, Ariz.

ECT’s Contact Products Group will be on hand to demonstrate the company’s latest semiconductor probes and answer customer inquiries related to its range of products, which include:

Patented Bantam® Series probes combine the most important features of a spring pin: excellent RF and DC electrical characteristics, and a robust mechanical design for a long, useful life. The combination of superior technology, insightful engineering and worldwide support result in the highest possible contactor performance and value.

ECT’s Mini-Mite® Series probes typically are used on ball or flat area arrays and feature a unique single-ended design, providing very low, consistent DC resistance. The uniform design allows all three products to be used at the same test height. The single sliding contact cuts the failure mode in half and ensures very repeatable results.

ECT’s CSP Series have become widely used industry standard probes. The series features multiple double-ended designs, providing wide flexibility in overall length, tip styles, spring forces, and exotic plating for lead-free applications. A work hardened barrel design and tips manufactured with ECT’s MicrosharpTM process ensure high quality and a long life. Whether testing flat arrays, QFNs or solder balls, this contact technology has become a legacy in the final ATE and SLT test contactor market.

ZIP™ Final Test probes from ECT, the innovators in Pogo® pin technology, provide the next generation of spring contact pin technology for lab and production test applications. While its scalable design allows for varying device-specific applications, this revolutionary combination of “flat” plunger geometry and compression spring technology delivers high-yield test performance combined with unparalleled manufacturing economy, providing a reduced cost of test (COT). Available in both high performance and economy versions, this family of “flat”designs can pay dividends on the final test floor. ZIP™ also looks to the future inside WLCSP testing applications as well as WLBI.

ZIP™ Burn-In vertically designed probes provide the next generation of spring contact pin technology for burn-in test. ZIP™ burn-in probes combine the revolutionary “flat” plunger geometry and compression spring technology with economical design features for reduced cost. Burn-in probes allow socketing flexibility in hybrid test-based applications. Easily socketed and field-replaceable, this family of “flat” designs can pay dividends in burn-in applications.

High-Frequency Coaxial products from ECT provide instrumentation quality interfacing for broadband RF measurements up to 12 GHz. K-50 Series probes can be used as Network Analyzer port-extending accessories for board-level impedance measurements that can be performed in the lab or in high-volume production environments with consistent and repeatable results.

Everett Charles Technologies, a subsidiary of Dover Corporation (NYSE: DOV), is a leading manufacturer of electrical test products and services, including semiconductor test products, bare-board automatic test systems, Pogo? test contacts, and bare and loaded PCB test fixtures. ECT manufacturing, service, and support facilities are ISO registered with locations throughout the Asia, the United States, and Europe. The company has been awarded numerous patents and participates actively in developing industry standards. Corporate offices for Everett Charles Technologies are located at 700 E. Harrison Ave., Pomona, California, USA, 91767. Additional information about ECT is available via the Internet at http://www.ectinfo.com.

You must be a registered user to talk back to us.

More News from Finetech

Apr 07, 2016 -

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

Sep 10, 2012 -

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

(77) more news from Finetech

ECT’s CPG TO FEATURE SEMICONDUCTOR PROBES AT BiTS 2010 news release has been viewed 537 times

SMT in-printer dispensing

Manufacturing Software