The presentation will be held during the session titled “Pb-Free Solders and Emerging Interconnect and Packaging Technologies: Microstructure, Intermetallics, Whisker (II),” which is scheduled to take place Thursday, February 18, 2010 from 8:30-11:45 a.m.
Since the electronics industry moved to lead-free solders that typically have a tin content of more than 95 percent there has been concern about the possibility of circuit malfunctions due to whisker growth. It is now generally accepted that whisker growth is a response to compressive stress within the tin crystal and the challenge is to identify and eliminate or at least minimize the processes that can generate such stress.
Corrosion has been identified as one source of that stress and in this paper the authors report a study directed at identifying the relationship between the extent of corrosion and the concomitant whisker growth. Printed circuit coupons with an OSP finish were soldered with SAC305 solder using wave, reflow, and hand soldering methods with flux formulations typical of current commercial practice.
About Nihon Superior Co. Ltd.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.