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Seika Machinery, Inc. Introduces Solder Paste Recycling Unit

Feb 08, 2010

TORRANCE, CA — February 2010 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, has introduced a Solder Paste Recycling Unit.

Seika’s new Solder Paste Recycling Unit enables approximately 90 percent of waste solder paste to be recovered as solder bar. The system provides a major decrease in disposal costs for factory waste, a reduction in CO2 emissions, and reduced costs for solder bar as a result of recycling waste.

In approximately 34 to 45 minutes, the Solder Paste Recycling Unit turns wasted solder paste into solder bar. As an additional benefit, the recycling unit enables selection of manual mode and automatic mode using a touch screen panel.

For more information about Seika’s new Solder Paste Recycling Unit, please contact Tim Cappoen at 770-446-3116, ext. 11, East coast time or Michelle Ogihara at 310-540-7310, ext. 120, West coast time.

About Seika Machinery, Inc.

Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.

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