SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Seika Machinery, Inc.

Seika’s Manufacturer Awarded Prime Minister’s Green Campaign Award

Feb 08, 2010

TORRANCE, CA — February 2010 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that HIOKI, the manufacturer of Seika’s 1240 Hioki Flying Probe Tester and ICT systems, was nominated as one of the recipients of the 2009 Green Campaign Award of the office

of the Japanese Prime Minister.

The award ceremony, with the Emperor and Empress of Japan in attendance, was held in April 2009 with HIOKI represented by its president, Mr. Tatsuyoshi Yoshiike.

The Prime Minister’s Green Campaign Award is presented to individuals and organizations that exhibit distinguished achievement towards greening efforts. A total of 13 awards were presented to persons, schools and organizations, as well as local public groups, based on recommendations by the Ministry of Economy, Trade and Industry.

HIOKI was highly evaluated and selected to receive this award based on its continued efforts to contribute to afforestation efforts around its factory. When the HIOKI factory moved to its current location in 1988, much of the original natural forest had to be destroyed.

With the aim of restoring the forest, HIOKI planted approximately 60,000 seedlings at the construction site. Since then, additional trees have been planted to culminate an approximated total of 80,000 trees over the roughly 52,000 sq. m. campus. HIOKI also has contributed to the local community through greening efforts and has established a scholarship fund ? all with the aim of being at one with the surrounding community.

The HIOKI flying probe provides numerous benefits over conventional testing machinery. Some of these benefits include jig-less inspection for quick set up, and the proficient testing of mismounted components, faulty components and poor contacts. Through resistance testing, the flying probe test is able to assess solder joints promptly, while thwarting board damage through use of the soft-landing feature.

About Seika Machinery, Inc.

Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.

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