SMT, PCB Electronics Industry News

SMT, PCB Electronics Industry News

News from Surface Mount Technology Association (SMTA)


SMTA Announces International Wafer-Level Packaging Conference (IWLPC) Call for Papers

Feb 01, 2010

Minneapolis, MN - The SMTA, in conjunction with Chip Scale Review magazine, is pleased to release the Call for Papers for the 7th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition (IWLPC) to be held October 11-14, 2010 at the Marriott Santa Clara Hotel in Santa Clara, CA. The IWLPC Technical Chair, Lee Smith of Amkor Technology, and the IWLPC Technical Committee would like to invite you to submit an abstract for this program on or before April 23, 2010.

The conference will include three tracks in 2010 with two days of papers covering:

  • Wafer Level Packaging

  • MEMS Packaging

  • 3-D Integration

This premier industry event explores leading-edge design, material, and process technologies focused on Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer level packaging solutions for integration, cost, and performance requirements.

Visit http://www.iwlpc.com/call_for_papers.cfm to view the complete Call for Papers and to submit an abstract. For more information contact Melissa Serres at 952-920-7682 or melissa@smta.org.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

You must be a registered user to talk back to us.

More News from Surface Mount Technology Association (SMTA)

Apr 26, 2017 -

SMTA/CALCE Announce Program for Symposium on Counterfeit Parts and Materials

Apr 11, 2017 -

IBM and Siemens Experts to Keynote Contamination, Cleaning and Coating Conference

Apr 07, 2017 -

The SMTA Capital Chapter to Host a Meeting April 25th at ZESTRON Americas

Mar 15, 2017 -

Contamination, Cleaning and Coating Conference Program Finalized

Feb 05, 2017 -

SMTA Announces 2017 Educational Programming

Jan 24, 2017 -

The SMTA Capital Chapter to Host First Meeting of the Year on February 23rd at The Test Connection

Jan 20, 2017 -

Symposium on Counterfeit Parts and Materials Call for Abstracts

Jan 17, 2017 -

International Conference on Soldering and Reliability Call for Abstracts

Dec 20, 2016 -

SMTA International 2016 Best Papers Announced

Nov 22, 2016 -

Hutchins Grant Award Winner Announced

(543) more news from Surface Mount Technology Association (SMTA)

SMTA Announces International Wafer-Level Packaging Conference (IWLPC) Call for Papers news release has been viewed 673 times

PCB machines

3D SPI