SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Call for Papers: International Conference on Soldering and Reliability

Call for Papers: International Conference on Soldering and Reliability

Jan 22, 2010

The drive for smaller, more functional consumer electronics along with the need for highly reliable electronics for industrial, bio-medical, aerospace and automotive applications have kept the material, process and quality engineers busy planning for the future. These drive the many challenges such as the use of finer powders in solder paste, the greater need for heat dissipation, the use of novel components and technologies. In addition, the European Union’s RoHS directive has now been joined by those of REACH, the dimethyl fumarate ban and the new Canadian Management plan on substances of concern for electrical and electronic equipment complicating matters considerably. The use of tailored alloy systems, the variety of alloy choices, and smaller passive component assembly are among the concerns being addressed. Soldering and reliability engineers and designers need to come together to share their knowledge and their vision for addressing these challenges.

Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto, Ontario, Canada since 2007, this conference will bring together the community of soldering and reliability experts. Show off the expertise of your company by presenting a paper.

ABSTRACTS ARE DUE JANUARY 29, 2010

Suggested topics to be covered include:

  • SnPb with lead-free components

  • Reliability

  • Harsh Environment

  • Tin Whiskers

  • New Alloys

  • Electromigration

  • Thermal dissipation

  • Manufacturing Process

  • Package on Package

  • Advanced Packaging

  • Halogen-Free Laminates

  • High Density Interconnects

  • Thermal Interface Materials

  • Underfill

If you would like to present at this conference, please submit a 200-300 word abstract to Melissa Serres at melissa@smta.org. Include a title, author name and contact information with your abstract. Authors will be notified of acceptance by February, 2010.

Technical papers are required and will be due on April 9, 2010.

The conference is sponsored by the SMTA Toronto Chapter.

Questions? Please contact:

Melissa Serres, Conference Coordinator

Phone: 952-920-7682

Email: melissa@smta.org

Apr 22, 2018 -

SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab

Apr 18, 2018 -

SMTA Europe's Harsh Environments Conference Session 6 to Focus on Automotive Electronics

Apr 17, 2018 -

International Conference for Electronics Enabling Technologies (ICEET) Program Finalized

Apr 16, 2018 -

Session 5 to Focus on Adhesives/Coatings at SMTA Harsh Environments Conference

Apr 15, 2018 -

Electrochemical Reliability Is the Focus of Session 4 at SMTA Europe's Harsh Environments

Apr 11, 2018 -

SMTA Europe's Harsh Environments Conference Session 3 to Focus on Advanced Test

Apr 09, 2018 -

Session 2 of SMTA Europe's Harsh Environments Conference to Focus on Reliability

Apr 09, 2018 -

SMTA Europe Announces 1st Session of Technical Program for Harsh Environments Conference

Apr 04, 2018 -

Harsh Environments Conference Professional Development Course: Shock at Vibration

Apr 03, 2018 -

SMTA Capital Chapter to Host Chapter Meeting

595 more news from Surface Mount Technology Association (SMTA) »

Apr 22, 2018 -

Tom Forsythe Will Present Industry 4.0 Cleaning Methods at the eSMART Factory Conference

Apr 22, 2018 -

STI Announces Ann Duncan’s Retirement

Apr 22, 2018 -

The Murray Percival Company Now Represents optical control’s Component Counting Technology

Apr 22, 2018 -

Sheri Pear Joins MicroCare, Will Focus on Customer Communication

Apr 22, 2018 -

Aegis Software Presents “MES Digitally Remastered” At SMT Nuremberg

Apr 22, 2018 -

Vi TECHNOLOGY to showcase the most innovative SPI product since the introduction of Moiré systems

Apr 22, 2018 -

Don’t Miss Ersa at the SMTA Empire Expo!

Apr 22, 2018 -

PDR Appoints Technical Marketing Company in the Rocky Mountain Region

Apr 22, 2018 -

SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab

Apr 19, 2018 -

ULT LLC cooperates with GulfTech

See electronics manufacturing industry news »

Call for Papers: International Conference on Soldering and Reliability news release has been viewed 911 times

  • SMTnet
  • »
  • Industry News
  • »
  • Call for Papers: International Conference on Soldering and Reliability
Metcal soldering rework