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SMTA International Conference on Soldering and Reliability Call for Papers

Jan 17, 2010

Minneapolis, MN - The SMTA Technical Committee cordially invites industry professionals to submit abstracts for the 2010 International Conference on Soldering and Reliability being held this May in Toronto, Ontario, Canada.

Abstracts are due by January 29, 2010. Following on the very successful 2005 and 2006 International Conferences on Lead-free Soldering, and the SMTA International Conference on Soldering and Reliability held in Toronto since 2007, this conference will bring together the community of soldering and reliability experts.

Suggested topics to be covered include:

  • SnPb with lead-free components

  • Reliability

  • Harsh Environment

  • Tin Whiskers

  • New Alloys

  • Electromigration

  • Thermal dissipation

  • Manufacturing Process

  • Package on Package

  • Advanced Packaging

  • Halogen-Free Laminates

  • High Density Interconnects

  • Thermal Interface Materials

  • Underfill

If you would like to present at this conference, please submit a 200-300 word abstract to Melissa Serres at melissa@smta.org. Include a title, author name and contact information with your abstract. Authors will be notified of acceptance by February, 2010. Technical papers are required and will be due on April 9, 2010.

The conference is sponsored by the SMTA Toronto Chapter.

For more information contact Melissa Serres at 952-920-7682 or melissa@smta.org or visit the Call for Papers online at http://smta.org/education/education.cfm#toronto.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

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