Head-in-Pillow defects have been found to cause a large percentage of failures in the reflow soldering of BGA/ CSP packages, especially in fine-pitch applications. In addition to reviewing the causes and solutions for Head-in-Pillow defects, Mr. Bath will discuss contributing factors, chemistry and process optimization related to the issue.
Mr. Bath is recognized as one of the leading experts on solder paste processing, and has been working on this challenging issue with a range of industry experts.
Further information, along with registration details can be found on the SMTA Web site at http://smta.org/education/presentations/presentations.cfm#hip or by visiting http://smta.org.
For further information, please visit http://www.christopherweb.com or contact:
Business Development Manager
Christopher Associates Inc.
3617 W. MacArthur Blvd.
Santa Ana, CA 92704
E mail: Roberto@christopherweb.com