High Accuracy Die Bonder on Display at SPIE Photonics West 2010

Jan 07, 2010

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 1026 at the upcoming SPIE Photonics West exhibition, scheduled for January 23-28, 2010 at the Moscone Center in San Francisco, CA.

The motorized configuration of the FINEPLACER® Lambda, which will be exhibited during Photonics West, provides auto-touchdown and die placement, as well as controlled bonding operation after manual alignment of die and substrate. Advantages of this system include hands-off die placement, process reproducibility, placement of die with dimensions that exceed the optical field of view and up to 10 programmable microscope positions. Additionally, the bonder is upgradeable with an integrated microscope.

Applications for the FINEPLACER® Lambda include eutectic, Indium and Au/Sn soldering, thermo compression, thermo-/ultrasonic bonding, and adhesive technologies. The process flexibility of this system makes it ideal for prototyping and R&D.

About FINETECH

FINETECH is a leading manufacturer of innovative micro assembly and rework equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona; Manchester, New Hampshire; Shanghai, China; and Penang, Malaysia.

High Accuracy Die Bonder on Display at SPIE Photonics West 2010 news release has been viewed 686 times

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