SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • Undetected Pressure Variations in Flip Chip Assembly Reduce Yields and Raise Costs

Undetected Pressure Variations in Flip Chip Assembly Reduce Yields and Raise Costs

Dec 22, 2009

Pressurex Reveals a Pressure Profile Across the Surface of a Flip Chip Bonder

Pressurex Reveals a Pressure Profile Across the Surface of a Flip Chip Bonder

Undetected bonding pressure variations can result in poor or open flip chip connections, reducing yield and long-term reliability while raising costs. Maintaining a uniform distribution of bonding pressure across a flip chip die assures chip to substrate coplanarity, optimal bump compression, and a controlled, reproducible die to substrate gap. Pressurex® pressure indicating sensor film is a valuable assist to today’s flip chip bonders which lack the capability to measure pressure variations across the bonding tool but instead rely on average pressure with the assumption that it is uniformly distributed. Now a proven control measure in wafer-to-wafer bonding, Pressurex® could extend similar low-cost coplanarity and uniformity control to flip chip bonding.

Pressurex® pressure-indicating sensor film provides a convenient, accurate, repeatable, and low cost control for both bonding and coplanarity. The thin flexible sensor film reveals pressures from 2 - 43,200 PSI (0.14 - 3,000 kg/cm2). When placed between the contacting surfaces of a flip chip bonder, it instantaneously and permanently changes color directly proportional to the amount of pressure applied. The precise pressure magnitude and distribution is then easily determined by comparing color variation results to a color correlation chart (conceptually similar to interpreting Litmus paper).

For further information and a complimentary sample of Pressurex® film in your desired range, contact Sensor Products Inc. at 1.973.884.1755 (USA), email info@sensorprod.com or visit http://www.sensorprod.com/sample. All products and applications can be viewed online.

About Sensor Products Inc.

Headquartered in New Jersey and established in 1990, Sensor Products Inc. is a world leader in the manufacture and distribution of tactile pressure sensing solutions. Their customized and off-the-shelf products are installed within all of the Fortune 500 industrial companies as well as thousands of smaller manufacturing firms. Their sensors are used in applications as diverse as tire testing to semiconductor manufacturing and from R&D labs to space missions. Additionally, Sensor Products provides in-house and on-site stress and pressure mapping analysis, as well as a variety of regional technical seminars.

Feb 19, 2010 -

Use of Pressurex Pressure Indicating Sensor Film Increases Bond Strength and Reduces Defects in Ultrasonic Welding of Electronics

Aug 09, 2009 -

Pressurex® Film Promotes Uniform Nip Pressure Distribution to Reduce Dry Film Resist PCB Lamination Defects

Nov 06, 2008 -

New Pressurex Zero� Sensor Film Measures and Maps Very Low Contact Pressures

Oct 16, 2007 -

Unique Tactile Pressure-Indicating Sensor Film Helps Capacitor Manufacturer Hold Tighter Product Tolerances

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

Aug 16, 2017 -

COT Increases Manufacturing Capability with New DMG Horizontal Milling Centers

Aug 16, 2017 -

High-Performance 3D AOI from Viscom at SMTAI

Aug 16, 2017 -

Innovative Bench-top Soldering Equipment from Metcal at SMTAI

Aug 16, 2017 -

ADLINK Introduces MVP-6010/6020 Series of Expandable Fanless Embedded Computers with Four Expansion Slots

Aug 16, 2017 -

SMTA Capital Expo to Feature Essemtec Fox Pick and Place System

Aug 16, 2017 -

All-in-One Low-cost, Scalable Functional test, In-System Programming, Boundary Scan / JTAG, In-Circuit Test System from Acculogic Visit Booth #133 at SMTA International

Aug 16, 2017 -

PDR’s New IR Thermal Test System Thermally Cycles Key Critical Components to Detect Defects

Aug 16, 2017 -

Automated X-ray Inspection with Component Counting from Scienscope at SMTAI

See electronics manufacturing industry news »

Undetected Pressure Variations in Flip Chip Assembly Reduce Yields and Raise Costs news release has been viewed 2358 times

  • SMTnet
  • »
  • Industry News
  • »
  • Undetected Pressure Variations in Flip Chip Assembly Reduce Yields and Raise Costs
PCB Assembly Equipment Auctions

ii-feed SMD Intelligent Feeder