SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • International Wafer-Level Packaging Conference (IWLPC) Best of Conference Paper and Plans for 2010 Announced

International Wafer-Level Packaging Conference (IWLPC) Best of Conference Paper and Plans for 2010 Announced

Dec 17, 2009

Minneapolis, MN - The SMTA and Chip Scale Review magazine are pleased to announce the Best of Conference Paper from the 6th Annual International Wafer-Level Packaging Conference and Exhibition, which was held October 27-30, 2009 at the Marriott Hotel in Santa Clara, California. After review by members of the 2009 IWLPC Technical Committee, In-Soo Kang (NEPES Corporation) has been selected as the Best of Conference award winner for his technical paper on "Development of Wafer Level Package of Normal and High Pin Count Devices for Mobile Applications."

The paper was selected based on the following criteria:

  • Technical paper must be provided (if speaker submitted an abstract only he/she does not qualify)

  • Must be original work - rehash of previously reported work does not qualify

  • Must include data - data can include application, design rules / modeling, technical data including mechanical dimensions for test vehicles, design of experiments matrix, assembly or reliability data.

  • Work must be pertinent to the industry, IWLPC and SMTA objectives

The paper can be found on the conference proceedings, and is available for purchase in the SMTA BookStore on-line at http://www.smta.org/store/book_store.cfm.

Plans are underway for the 2010 conference. Lee Smith, Amkor Technology, will act as technical Chair. Ken Gilleo, ET-Trends LLC, will be the General Chair. New members of the technical committee are Francoise von Trapp, 3D Incites, and Ron Edgar, Chip Scale Review.

Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.

For more information contact Melissa Serres Marx at 952-920-7682 or melissa@smta.org.

Visit http://www.iwlpc.com to view the full program and watch for a complete event review.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Jul 23, 2017 -

SMTA Welcomes New Board Members

Jul 23, 2017 -

SMTA International Technical Program Expands, Includes Research from HDPUG and AREA Consortium

Jul 19, 2017 -

International Wafer-Level Packaging Conference (IWLPC) Program Announced and Registration Now Open

Jul 11, 2017 -

Microsoft’s Jensen to Keynote SMTA International

Jul 10, 2017 -

SMTA Capital Chapter’s Expo and Tech Forum to be Held on August 24th

Jun 28, 2017 -

SMTA Releases Wave Soldering Online Course

Jun 20, 2017 -

SMTA Launches New Partnership with Thayer School of Engineering at Dartmouth College

Jun 08, 2017 -

SMTA International Conference Program Finalized and Registration Now Open

May 30, 2017 -

SMTA and CALCE Seeking Abstracts for 3rd Annual LED Assembly, Reliability, and Test Symposium

May 23, 2017 -

SMTA, iNEMI, MEPTEC Seek Presenters for 2018 Medical Electronics Symposium

553 more news from Surface Mount Technology Association (SMTA) »

Jul 23, 2017 -

PDR Americas Partners with Orr Marketing, Inc. in the Carolinas

Jul 23, 2017 -

Zuken Announces XJTAG DFT Assistant for CR-8000 PCB design suite

Jul 23, 2017 -

Senator Ron Johnson Discusses U.S. Policy Priorities in Townhall Discussion with IPC-member Company, VirTex MTI

Jul 21, 2017 -

Epec Now Offering PCB Layout and Design Services

Jul 21, 2017 -

Help customer solve problems of 750L machine

Jul 19, 2017 -

Digicom Electronics Receives AS9100:2016 (RevD) Aerospace and ISO 9001:2015 Certifications

Jul 19, 2017 -

Conecsus Presents SMT Metals Waste Recycling Solutions at SMTAI 2017

Jul 19, 2017 -

New Metcal HTD Tips & Hand-piece Increase Throughput and Save Money

Jul 19, 2017 -

Altus Supports Bespoke Desktop Robots for Automated Soldering, from ATN Germany

Jul 19, 2017 -

STI Acquires Fischerscope X-ray XDAL 237

See electronics manufacturing industry news »

International Wafer-Level Packaging Conference (IWLPC) Best of Conference Paper and Plans for 2010 Announced news release has been viewed 1249 times

  • SMTnet
  • »
  • Industry News
  • »
  • International Wafer-Level Packaging Conference (IWLPC) Best of Conference Paper and Plans for 2010 Announced
ii-feed SMD Intelligent Feeder

fluid dispensing pumps for integration