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  • Christopher Associates Premiers Solder Pastes from Koki for ICT Performance and Fine-Pitch Printing

Christopher Associates Premiers Solder Pastes from Koki for ICT Performance and Fine-Pitch Printing

Dec 14, 2009

December 2009 ? Christopher Associates, a pioneering supplier and distributor to the electronics and chemical processing industries, introduces two new solder pastes from Koki Company Ltd. (Tokyo, Japan).

S3X58-M650 is an ICT testable, halogen-free product that uses the SAC 305 alloy. Properties include low voiding, high print speeds, and fine-pitch (µBGA, 0.4 mm pitch) capability.

The other Koki paste is S3X70-M407, a lead-free no-clean solder paste for ultra-fine-pitch applications. Using a Type 5 powder, S3X70-M407 solder paste has been formulated for 0.2 mm pitch µBGA devices, as well as 0402 (01005) components. Features include excellent wetting in air environments and low voiding.

Koki has more than 45 years of experience in high-technology soldering applications, and is the leader in both no-clean and lead-free soldering applications. With global manufacturing, research and support, Koki continues to develop new technologies to meet and customers’ requests.

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Christopher Associates to Introduce Leading-Edge SPI at the 2012 IPC APEX EXPO

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Christopher Associates to Display High-Magnification Tagarno Magnus HD Trend at Both SMTA Dallas and Houston 2012

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Christopher Associates' Jasbir Bath to Moderate Solder Joint Testing and Performance Meeting at IPC APEX 2012

Jan 26, 2012 -

Christopher Associates' Jasbir Bath to Present on Lead-free Alloys at IPC APEX 2012

Jan 21, 2012 -

Christopher Associates to Unveil New SPI Unit at the 2012 IPC APEX Expo

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