Providing an “out of the box” solution, FINEPLACER® core is based on Finetech’s proven hot air technology and has been designed to meet the requirements of professional rework applications – for today and tomorrow.
Compact design, full functionality
This compact rework station allows integration of the complete rework cycle: component removal, site cleaning, re-balling (array), paste printing (component, PCB), paste dipping, fluxing and soldering, all with an efficient design and without diminishing functionality.
FINEPLACER® core features a placement accuracy better than 25 µm, advanced thermal management with integrated hot air top and bottom heating, the patented FINEPLACER® vision alignment system, automated processes, force measurement and nitrogen support as standards.
Designed for consumer electronics production environments
FINEPLACER® core offers professional rework capabilities for a wide spectrum of SMD components commonly found in consumer electronic environments.
The application area ranges from chip sizes of 0.25 mm up to 50 mm on board sizes up to 400 mm x 300 mm.
The advanced thermal management provides coordinated control of top and bottom heating as well as all process-related parameters: temperature, flow, time and process environment.
Automated processes with force measurement allow user-independent process operation after alignment and guarantees highly reproducible process results.
A real-time process observation video solution gives immediate visual feedback (to reduce process development times).
Available in two configurations
FINEPLACER® core will be available in two versions: While “FINEPLACER® core” comes with a bottom heater designed for more sensitive applications on small boards up to 100 mm x 100 mm (e.g. mobile devices), the “FINEPLACER® coreplus” is dedicated to reworking standard applications on medium sized PCBs.
FINEPLACER® core will be available from January, 2010.
FINETECH is a leading manufacturer of equipment for manual and fully automatic circuit board repair and high-precision insertion of electronic/optical components, plus assembly and fitting of complex opto-electronic systems.
The modular FINEPLACER® systems offer maximum process flexibility in many different connection technologies. They include a wide variety of soldering and adhesive technologies, as well as ultrasonic and thermal compression bonding. FINEPLACER® systems are used especially in R&D, prototype building and small series production.
Finetech's customers include companies in the aerospace, automobile, medical/bio/solar technology, optoelectronics, semiconductor, consumer electronics and defence sectors, together with education and research establishments. Finetech is able to respond to specific requirements and offers tailor-made solutions for demanding customer applications. Finetech is represented by direct subsidiaries in its core markets and offers on-site application support and advice. It is also represented world-wide by a network of agencies.
The headquarters of FINETECH is Berlin, with subsidiaries in Phoenix (AZ), Shanghai and Penang / Malaysia.