SMT, PCB Electronics Industry News

New FINEPLACER® core –Debut at Productronica 2009

Dec 07, 2009

At the Productronica 2009 tradeshow in Munich, Finetech will introduce its upcoming entry-level rework system, the FINEPLACER® core.

Providing an “out of the box” solution, FINEPLACER® core is based on Finetech’s proven hot air technology and has been designed to meet the requirements of professional rework applications – for today and tomorrow.

Compact design, full functionality

This compact rework station allows integration of the complete rework cycle: component removal, site cleaning, re-balling (array), paste printing (component, PCB), paste dipping, fluxing and soldering, all with an efficient design and without diminishing functionality.

FINEPLACER® core features a placement accuracy better than 25 µm, advanced thermal management with integrated hot air top and bottom heating, the patented FINEPLACER® vision alignment system, automated processes, force measurement and nitrogen support as standards.

Designed for consumer electronics production environments

FINEPLACER® core offers professional rework capabilities for a wide spectrum of SMD components commonly found in consumer electronic environments.

The application area ranges from chip sizes of 0.25 mm up to 50 mm on board sizes up to 400 mm x 300 mm.

The advanced thermal management provides coordinated control of top and bottom heating as well as all process-related parameters: temperature, flow, time and process environment.

Automated processes with force measurement allow user-independent process operation after alignment and guarantees highly reproducible process results.

A real-time process observation video solution gives immediate visual feedback (to reduce process development times).

Available in two configurations

FINEPLACER® core will be available in two versions: While “FINEPLACER® core” comes with a bottom heater designed for more sensitive applications on small boards up to 100 mm x 100 mm (e.g. mobile devices), the “FINEPLACER® coreplus” is dedicated to reworking standard applications on medium sized PCBs.

FINEPLACER® core will be available from January, 2010.

About Finetech

FINETECH is a leading manufacturer of equipment for manual and fully automatic circuit board repair and high-precision insertion of electronic/optical components, plus assembly and fitting of complex opto-electronic systems.

The modular FINEPLACER® systems offer maximum process flexibility in many different connection technologies. They include a wide variety of soldering and adhesive technologies, as well as ultrasonic and thermal compression bonding. FINEPLACER® systems are used especially in R&D, prototype building and small series production.

Finetech's customers include companies in the aerospace, automobile, medical/bio/solar technology, optoelectronics, semiconductor, consumer electronics and defence sectors, together with education and research establishments. Finetech is able to respond to specific requirements and offers tailor-made solutions for demanding customer applications. Finetech is represented by direct subsidiaries in its core markets and offers on-site application support and advice. It is also represented world-wide by a network of agencies.

The headquarters of FINETECH is Berlin, with subsidiaries in Phoenix (AZ), Shanghai and Penang / Malaysia.

www.finetech.de

Jan 14, 2019 -

Finetech to Demo Contactless Residual Solder Removal at IPC APEX 2019

Apr 07, 2016 -

Finetech/Martin Introducing New Rework and Dispense Solutions at IPC APEX 2016

Nov 27, 2013 -

Martin Streamlines and Simplifies Rework with New Process Shuttle

Nov 08, 2013 -

Finetech Unveils High Force ACF Bonder

May 28, 2013 -

Al Cabral Joins Finetech as Regional Sales Manager

Mar 11, 2013 -

Donated Finetech Die Bonder Installed at Pennsylvania State University

Jan 16, 2013 -

Finetech to Exhibit the Ideal Blend of Performance and Cost Rework Technology at the 2013 IPC APEX EXPO

Jan 04, 2013 -

Finetech to Exhibit Sub-micron Die Bonder at SPIE Photonics West

Oct 03, 2012 -

The Best in Rework Technology – Finetech to Exhibit FINEPLACER® Core Rework System at SMTA International

Sep 26, 2012 -

MARTIN to Demonstrate Mini-Oven Reball/PreBump Unit at the Mississauga EPTECH Electronics Show

77 more news from Finetech »

Apr 19, 2024 -

ViTrox Pioneering the Future of Smart Manufacturing at NEPCON China 2024! Booth #1H27

Apr 18, 2024 -

ViTrox Technologies Elevates Service & Support Across US & Canada with Jeremy Woodworth's Appointment!

Apr 16, 2024 -

I.C.T | Your One-Stop Service for Smart Meter SMT Factory

Apr 15, 2024 -

Data I/O Announces Major Milestone with 500th PSV System Sale Ahead of IPC APEX Expo

Apr 15, 2024 -

Seika Machinery Recognizes Outstanding Sales Achievements at 2024 IPC APEX EXPO

Apr 15, 2024 -

Altus Group Celebrates 30 Years of Innovation with Scienscope

Apr 11, 2024 -

Congratulations on the Founding of Unicomp Advanced Inspection Applied Technology Research Institute!

Apr 11, 2024 -

Auction Name: New Brunswick Ind. Circuit Board ManufacturingDate(s) 4/9/2024 - 4/16/2024

Apr 09, 2024 -

Panasonic Connect to Showcase New Automated Manufacturing Solution at IPC APEX Expo 2024

Apr 09, 2024 -

UNLOCK PEAK AUTOMATION EFFICIENCY WITH MENCOM AT AUTOMATE 2024

See electronics manufacturing industry news »

New FINEPLACER® core –Debut at Productronica 2009 news release has been viewed 760 times

Thermal Interface Material Dispensing

convection smt reflow ovens