SMT, PCB Electronics Industry News

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News from CyberOptics Corporation

Cyberoptics to Launch ‘Larger Board’ Version of New SE500 Solder Paste Inspection System at Productronica 2009

Dec 07, 2009

CyberOptics Limited has announced plans to showcase its SE500X advanced 100 percent 3-D solder paste inspection system, the newly developed ‘larger board’ version in the SE500 series at Productronica 2009. Hot on the heels of the successful debut of the original SE500 in Germany at the 2009 SMT/Hybrid/Packaging show, CyberOptics will feature the fastest inspection system on the market in Hall A2, Stand 417 at Productronica. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.

Now able to accommodate boards/panels measuring 100 x 100 mm up to 810 x 610 mm, CyberOptics redefines inspection speed with the new SE500X 100 percent 3-D solder paste inspection system. This system has the ability to inspect even the most demanding assemblies with >80 cm2 /second inspection speed that does not compromise measurement accuracy and repeatability.

Building on CyberOptics’ reputation as the provider of solder paste inspection systems with industry-leading volume accuracy, the SE500 and larger board SE500X systems can inspect pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing line speeds.

This gives the SE500 product line two models in the series to accommodate different board/panel sizes. The SE500 features a conveyor that can transport board/panels from 50 x 50 mm up to 510 x 510 mm, while the SE500X can accommodate 100 x 100 mm up to 810 x 610 mm.

Standard features for both models include: automatic conveyor width adjustment, mechanical board stop, 1- and 2-D multiple barcode read using the sensor, and Process Tracker™ SPC charts with alarm capability in the Operator User Interface. Additionally, the SE500 has enhanced warp compensation for flexible circuits, the ability to handle odd-shaped pads, and an XML file format output for easy integration to shop floor control systems. The SE500 also can run program files originally created for the SE 300 Ultra.

Both the SE500 and the SE500X will be demonstrated during the four day event.

Visitors will also be able to see CyberOptics award-winning Flex High-Resolution automated optical inspection system, Flex HR.

Flex HR is CyberOptics enhanced resolution AOI system with inspection performance for 01005 components. As one of the highest-speed inspection systems in the industry, Flex HR is ideal for assembly lines producing a wide range of products including memory modules, notebooks PCs, mobile phones, automotive products and other industrial electronic assemblies. 

Flex HR Software – CyberOptics has enhanced the FLEX HR inspection software with auto-seeding capability. The auto-seeding function adds fast and automatic model building by automatically selecting best examples from the supplied training set. Creating a robust model with the auto-seeding function is simple and fast and is a one-click operation during programming.

The team at CyberOptics look forward to welcoming visitors to stand Hall A2, Stand 417 during the four day event.

About CyberOptics Corporation

Founded in 1984, CyberOptics is a recognized leader in process yield and throughput improvement solutions for the global electronics assembly and semiconductor capital equipment markets. Headquartered in Minneapolis, MN, CyberOptics conducts operations in North America, Asia and Europe. For more information, visit the company’s Web site at

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Cyberoptics to Launch ‘Larger Board’ Version of New SE500 Solder Paste Inspection System at Productronica 2009 news release has been viewed 770 times

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