OTS from DEK is a sophisticated device that clamps the board flat before enabling finite snugging and clamp control for precise board location. The board is pulled down flat to enable a strong vacuum tooling contact; the clamps are then pulled away from the board top face surface to allow close edge printing. By optimizing edge printed paste deposits, this process substantially enhances yield potential. In fact, initial reports from the technology’s evaluation period saw one customer improve paste deposition with OTS by 20%.
In addition to optimal paste deposition, the OTS system is highly flexible, automatically adjusting for variations in board thickness, eliminating setup requirements between production batches and runs - thereby removing the need for manual intervention. Reinforcing the flexibility and security of substrate location even further, OTS’ compliant clamps will also automatically adjust for out-of-parallel boards. The technology uses the next-generation Instinctiv™ V9 user interface software to adjust and store clamp and snug pressure via a touch-screen interface for ease of use and enhanced flexibility. OTS is compatible with all tooling variants, including DEK’s popular HD Grid-Lok® system.
Commenting on the new technology, DEK’s David Jefferies, Project Leader explains: “Delivering numerous advantages over edge clamp tooling and foiless clamps, OTS is an important innovation for DEK customers – who already know they can expect more when they partner with us. Improved print quality at the board edge due to automatic compensation for small variations between boards of the same batch, an articulated top plate ensuring effective paste roll, and quick-set leveling ensuring no deviation in print quality; these are just a few of the benefits customers can expect with OTS. And, integrating an impressive 16 pneumatic cylinders and six precision guides, the unit is completely reliable to give manufacturers absolute peace-of-mind.”
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DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. For more information, visit DEK at http://www.dek.com.