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SEHO Introduces the PowerRepair Soldering System

Nov 19, 2009

ERLANGER, KY ? November 2009 ? SEHO Systems GmbH, a leading worldwide soldering provider, introduces the PowerRepair soldering system, designed for professional de-soldering and soldering of through-hole components to PCBs. The unit also can be used for soldering components.

The system features mini-wave soldering technology, which is able to realize de-soldering/soldering of components with a high number of pins and with different pin rows (connectors). As an additional benefit, the system features de-soldering/soldering of components with high thermal mass (thick pins, multilayer boards etc.), and is compatible with all lead-free solder alloys.

The PowerRepair’s soldering nozzle ensures a high energy transfer rate, even for high-temperature applications. The system also features short repair cycles, even for high-mass components, and guarantees low thermal stress for both the PCB as well as for the components. All soldering parameters on the PowerRepair are programmable to ensure a defined and repeatable repair process.

For more information about Seho Systems’ PowerRepair, visit http://www.sehona.com.

About SEHO Systems GmbH

Since its foundation in 1973, SEHO has become the worldwide contact partner whenever soldering is involved. Company solutions are based on performance, flexibility, efficiency and technical progress. SEHO’s business activities and production organization are oriented according to the principles of sustained future-compatible development and production of machines. As a result, all applicable environmental standards are complied with meticulously. With its systems, the company provides customers with a sustained and resource economizing production facility. It continuously develops its technology in order to provide customers with a competitive advantage. For more information, visit http://www.seho.de.

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