Beginning on Tuesday, the technical program will consist of sessions on Process Technologies, Electrochemical Failure Mechanisms, Success Strategies, and a Keynote Presentation, "Nanotechnology is Now Starting to Find Applications in Electronics" by Alan Rae, Ph.D., TPF Enterprises LLC.
Continuing on Wednesday, the technical program will feature sessions on Surface Finishes, Inspection and Failure Analysis, Manufacturing Challenges, SiP Solutions, Failures in Manufacturing, and another Keynote Presentation, "Solar Cells on Ultra-Thin Silicon" by Robert Mertens, Ph.D., IMEC.
Concluding on Thursday, the technical program will have sessions on Optimization Techniques and TSV for 3D Packaging.
Each year the Exhibition & Symposium attracts attendees from more than 15 different countries throughout Europe, the Americas, and the Pacific Basin. View the complete program and register at the website: http://www.smta.org/panpac. Please contact JoAnn Stromberg, firstname.lastname@example.org or 952-920-7682, with questions.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.