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FCT Assembly’s UltraSlic FG Solder Paste Stencil Wins a 2009 Global Technology Award

Nov 11, 2009

GREELEY, CO —FCT Assembly announces that it has been awarded a Global Technology Award in the category of Printing Equipment for its UltraSlic™ FG solder paste stencil. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

UltraSlic™ FG solder paste stencil is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic™ FG outperforms all existing stencil technologies on the market today. Using the latest stencil laser technology and Datum Alloys’ new Fine Grain stencil material, exclusively distributed by Ed Fagan, Inc., UltraSlic™ FG stencils provide superior aperture registration, higher performance and lower cost compared to electroform, the option of step stencils, and the option of same day turnaround times.

Premiering in 2005, the Global Technology Awards program is an annual celebration of product excellence in electronics surface mount assembly. Premier products based on the finest examples of creative advancement in technology are chosen by a distinguished panel of industry experts.

About FCT Assembly

FCT Assembly was created after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder (both conventional 63/37 and SN100C® lead-free) bar. The assembly products are manufactured in the Greeley, Colo. plant and the stencils are manufactured in the Beaverton, Ore., Memphis, Tenn., and Greeley, Colo. facilities. The stencils can be fabricated by both laser cutting and chemical etch. The company also makes precision parts in its A-Laser division, which is located in Beaverton, Ore. For more information, visit http://www.fctassembly.com.

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