SMT, PCB Electronics Industry News

Kyzen to Participate in IPC Lean Sigma Event

Nov 05, 2009

NASHVILLE — November 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that its Rich Brooks, a trained Six Sigma Black Belt, will present “Lean Sigma Methodology for Selecting the Best Fit Cleaning Agent” at the IPC Lean Sigma Conference, scheduled to take place November 17-19, 2009 at the Fiesta Inn in Tempe, Ariz.

Process engineers looking to clean electronics assemblies typically start by identifying the cleaning equipment and cleaning material. Many use a small subset of test vehicles to qualify the process. This technique worked well when qualifying a cleaning process for conventional designs but typically fails to address numerous factors when designing leading edge cleaning processes. The design of the cleaning process must dig into critical factors such as the electronic assemblies being cleaned, characterization of the flux residue, cleaning agent options, materials compatibility, confirmation in the cleaning equipment, and process validation.

This case study will demonstrate a lean sigma approach to designing a cleaning process. The methodology follows five steps for selecting the best fit cleaning agent for a demanding Class 3 high reliability OEM. The first step is to establish the solubility parameter for the flux residue in question. Once the solubility parameter for the flux residue is established, solubility data on cleaning agents with solubility parameters similar to the flux residue will be tested at various levels to determine the best fit cleaning agent parameters. Materials compatibility testing on part hardware is the third step in the process. If materials compatibility testing meets stated objectives, validation in selected cleaning equipment on customer hardware is confirmed. If the each of these steps meets the stated objectives, process validation is run to qualify the process.

Aug 15, 2017 -

KYZEN to Show Real-Time Data Analyst for All Cleaning Processes at SMTAI

Aug 06, 2017 -

Dr. Mike Bixenman Receives Best Paper Award for His Presentation at ICSR

Jul 17, 2017 -

KYZEN to Show First of Its Kind, Real-Time Concentration Monitoring & Reporting System at NEPCON South China

Jun 13, 2017 -

SEMICON West

May 31, 2017 -

KYZEN Expands EU Facilities to Meet Growing Demand

May 22, 2017 -

Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR

May 21, 2017 -

Cleaning & Coating Conference in Amsterdam

May 18, 2017 -

KYZEN Exhibits at SMTA Toronto Expo / ICSR

Apr 26, 2017 -

KYZEN Awarded for New Industry 4.0 Enabled KYZEN ANALYST™ at NEPCON China

Apr 22, 2017 -

KYZEN’s Newest Innovation, the KYZEN ANALYSTTM, Will Be Launched at SMT Hybrid Packaging 2017 this May!

415 more news from KYZEN Corporation »

Aug 19, 2017 -

See Latest Dispense Technology Demonstrations From GPD Global at NEPCON 2017

Aug 17, 2017 -

ZESTRON Americas Announces New Regional Sales Manager

Aug 17, 2017 -

SEHO Soldering Expert to Discuss Resource & Cost Efficient Wave Soldering at SMTAI

Aug 17, 2017 -

Libra Industries Announces Two 20-Year Service Awards in Q2 2017

Aug 17, 2017 -

Cirtronics Installs High-Performance X-ray Inspection Solution

Aug 17, 2017 -

Essemtec to Show New All-in-One Jetting / Placement System at SMTAI

Aug 17, 2017 -

Engineered Material Systems to Introduce New Conductive Adhesives for Stringing and Shingling Next-Generation Solar Modules at EU PVSEC

Aug 17, 2017 -

What is SMT and where to by SMT spare parts

Aug 16, 2017 -

ViTrox and KIC Establish Cooperation and Connectivity

Aug 16, 2017 -

Inovaxe Is Making Storage SMARTER – Visit Booth #915 at SMTAI

See electronics manufacturing industry news »

Kyzen to Participate in IPC Lean Sigma Event news release has been viewed 716 times

SMT Custom Nozzles

Europlacer iineo+ SMT pick and place with integrated component tester