SMT, PCB Electronics Industry News

Kyzen to Participate in IPC Lean Sigma Event

Nov 05, 2009

NASHVILLE — November 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that its Rich Brooks, a trained Six Sigma Black Belt, will present “Lean Sigma Methodology for Selecting the Best Fit Cleaning Agent” at the IPC Lean Sigma Conference, scheduled to take place November 17-19, 2009 at the Fiesta Inn in Tempe, Ariz.

Process engineers looking to clean electronics assemblies typically start by identifying the cleaning equipment and cleaning material. Many use a small subset of test vehicles to qualify the process. This technique worked well when qualifying a cleaning process for conventional designs but typically fails to address numerous factors when designing leading edge cleaning processes. The design of the cleaning process must dig into critical factors such as the electronic assemblies being cleaned, characterization of the flux residue, cleaning agent options, materials compatibility, confirmation in the cleaning equipment, and process validation.

This case study will demonstrate a lean sigma approach to designing a cleaning process. The methodology follows five steps for selecting the best fit cleaning agent for a demanding Class 3 high reliability OEM. The first step is to establish the solubility parameter for the flux residue in question. Once the solubility parameter for the flux residue is established, solubility data on cleaning agents with solubility parameters similar to the flux residue will be tested at various levels to determine the best fit cleaning agent parameters. Materials compatibility testing on part hardware is the third step in the process. If materials compatibility testing meets stated objectives, validation in selected cleaning equipment on customer hardware is confirmed. If the each of these steps meets the stated objectives, process validation is run to qualify the process.

Jun 13, 2017 -


May 31, 2017 -

KYZEN Expands EU Facilities to Meet Growing Demand

May 22, 2017 -

Dr. Mike Bixenman Discusses Non-Standard Test Methods at ICSR

May 21, 2017 -

Cleaning & Coating Conference in Amsterdam

May 18, 2017 -

KYZEN Exhibits at SMTA Toronto Expo / ICSR

Apr 26, 2017 -

KYZEN Awarded for New Industry 4.0 Enabled KYZEN ANALYST™ at NEPCON China

Apr 22, 2017 -

KYZEN’s Newest Innovation, the KYZEN ANALYSTTM, Will Be Launched at SMT Hybrid Packaging 2017 this May!

Apr 11, 2017 -

Conference, May 22-24, 2017 in Amsterdam

Feb 20, 2017 -

KYZEN Earns 10th Service Award for Superior Customer Service

Feb 15, 2017 -

KYZEN Is Two for Two with the 2017 NPI Awards for the ANALYST™ and DS3522 DuoSolvent™

412 more news from KYZEN Corporation »

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

Jun 21, 2017 -

PNC Inc. Launches Design Webinar Series

Jun 21, 2017 -

Saelig Introduces Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer With Type-C Connection

Jun 20, 2017 -

Europlacer Secures Fourth Award from Industry Analysts Frost & Sullivan.

Jun 20, 2017 -

In Memory of Jim D. Raby, PE

Jun 20, 2017 -

Micro-Focused IR Thermal Testing with PDR's Focused IR

Jun 20, 2017 -

SCS to Present ‘Using Conformal Coatings to Mitigate System Failures’ during upcoming Webinar

See electronics manufacturing industry news »

Kyzen to Participate in IPC Lean Sigma Event news release has been viewed 664 times

SMT Custom Nozzles

Reflow Oven