SMT, PCB Electronics Industry News

FCT Assembly Debuts NL930 Lead-free No-Clean Solder Paste

Nov 02, 2009

GREELEY, CO —FCT Assembly premiers NL930, a lead-free, no-clean solder paste that features the company’s latest technology in print and reflow of paste in the no-clean category.

NL930 paste features excellent solderability, enabling the process to handle the most difficult wetting requirements. It also improves stencil life and provides superior cosmetics, especially when using SN100C. The lead-free paste offers excellent print consistency with high process capability index across all board designs, as well as excellent wetting characteristics on all pad finishes. Furthermore, post-reflow flux residues are penetrable, maximizing pin testability.

NL930 is compatible with SN100C and SAC alloys with Type 3, 4 and 5 solder meshes. It is the ideal solution for cosmetic residue issues, and boards with OSP, ENIG, Immersion Silver, and Immersion Tin finishes.

Results from using NL930 solder paste include IPC 7095 Class III resistance to voiding using straight ramp or soak reflow profiles, excellent reliability properties, halide-free material graded RELO, and a reduction in random solder balling levels, minimizing rework and increasing first time yield.

“We are spending a lot of time and energy on the development of our solder paste line. One of our goals is to have robust products that are halide free. NL930 is our newest No-Clean, Halide free solder paste that is very robust in printing, wetting, and pin probability. We are very excited to be adding this solder paste to our product portfolio,” said Mike Scimeca, President and CEO.

NL930 provides consistent stencil performance, with more than eight hours of print life. The paste also features high-volume repeatability with 16 mm pitch QFP pads and 12 mm circles, as well as excellent response to one-hour pause, after two knead strokes at 35-65 percent RH.

About FCT Assembly

FCT Assembly was created after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder (both conventional 63/37 and SN100C® lead-free) bar. The assembly products are manufactured in the Greeley, Colo. plant and the stencils are manufactured in the Beaverton, Ore., Memphis, Tenn., and Greeley, Colo. facilities. The stencils can be fabricated by both laser cutting and chemical etch. The company also makes precision parts in its A-Laser division, which is located in Beaverton, Ore. For more information, visit

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