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News from Nihon Superior Co., Ltd.


Nihon Superior to Highlight a Complete Suite of SN100C Soldering Materials at SMTA Southeast Asia Technical Conference 2009

Nov 02, 2009

OSAKA, JAPAN — November 2009 — Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global electronics industry announces that it will display a full range of products based on its unique lead-free solder SN100C in its booth at the SMTA Southeast Asia Technical Conference on Electronics Assembly Technologies at the Equatorial Hotel in Penang, Malaysia, November 18-20, 2009.

This will include solder pastes, solder wires, solder spheres and even preforms as well as the solder bar that introduced this revolutionary solder to the market in wave soldering, rework and hot air solder leveling. To give visitors a chance to appreciate their excellent performance, Nihon Superior will be demonstrating manual soldering with their series of flux-cored SN100C solder wires.

To showcase the versatility of SN100C there will also be a display of production boards soldered with the following products:

A highlight of this new range is the halogen-free solder paste and solder wire core flux which include no fluorine (F), chlorine (Cl), bromine (Br) or iodine (I) in their formulation, while still delivering excellent wetting on all substrates.

Flux-Cored Solder Wire

SN100C (040) is a halogen-free, no-clean flux-cored lead-free solder wire with good separation of the solder from the tip to minimize icicles and a crack-free residue. The SN100C solder delivers smooth bright fillets free of shrinkage defects, reduced copper erosion and a stable intermetallic layer that ensure reliability in service.

SN100C (030) is a no-clean, flux-cored, lead-free solder wire also with good separation of the solder from the tip. The stable resin base of the flux means reduced carbonizing of the soldering tip and the solder residue and less flux spatter. High flux activity makes possible fast sequential soldering with good wetting and flow.

Ultrafine Wire and Preforms

The fine uniform grain structure of SN100C means that it can be supplied in the form of flux- cored wire with a diameter as low as 0.1mm, finer than any SAC alloy can be drawn. And SN100C can now be supplied as foil from which preforms can be cut to order.

Solder Pastes

Although the 227°C melting point of SN100C is higher than that of tin-silver-copper alloys in most cases it can reflowed with a profile with a peak temperature around 240°C, similar to that typically used with SAC305 an SAC405..

SN100C P600 is a halogen-free lead-free no-clean solder paste designed for fine pitch application. It has stable printability and provides excellent reflow with good wetting and minimum incidence of mid-chip balling.

SN100C P520 is a no-clean, lead-free solder paste optimized for chip components down to 01005 (0402 metric). SN100C P520 ensures joint quality on densely populated boards with filletless chip components with a small solder volume and fine-pitch mounting in which there is a concern about low joint strength because of the very small joint size. Additional benefits include low residue, excellent reflow on small pads, good hot slump performance, stable printability on small pads and excellent wetting behavior (even on brass and nickel). SN100C is a compliant alloy that provides impact strength comparable with that obtained with tin-lead solder.

SN100C P500 is a no-clean, general purpose lead-free solder paste. Because of the high fluidity of SN100C close to its melting point and fast wetting, SN100C P500 can be used as a drop-in replacement for SAC solder paste in reflow profiles that peak around 240°C. However, it brings to reflow soldering the advantages that have made SN100C such a popular choice in wave soldering, smooth shiny fillets with no shrinkage defects, high ductility and stable intermetallic with consequent superior performance under vibration, and impact loading. The SN100C P500 no-clean, halide-free medium delivers excellent printability, long stencil life, good tack, excellent reflow and wetting on all substrates with no solder balls and minimal clear residue.

Liquid Flux

NS-F850 is a rosin-based liquid flux for lead-free wave soldering that ensures excellent wetting of all PCB and component substrates to deliver maximum through-hole fill and facilitate the solder drainage that keeps bridges and icicles to a minimum. The high solids content of NS-F850 and robust activation systems means that it is the ideal flux for lead-free wave soldering of thick multilayer boards that require long preheats, higher solder temperatures and longer contact times. The high solids content also means that NS-F850 prevents solder balls adhering to solder mask, ensures that the full reliability potential of SN100C lead-free solder is realized.

For further information about any of the above products, please visit the Nihon Superior Malaysia booth at the SMTA Southeast Asia Technical Conference.

About Nihon Superior Co. Ltd.

Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.

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Nihon Superior to Highlight a Complete Suite of SN100C Soldering Materials at SMTA Southeast Asia Technical Conference 2009 news release has been viewed 665 times

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