Sep 18, 2009 
Cobar Solder Products also will display its XF3+ lead-free solder paste, developed to accommodate extended reflow profiles with or without the use of nitrogen. With XF3+, wetting on all common pad finishings is excellent, yielding shiny joints reminiscent of leaded solders. It also exhibits a robust printing window.
SN100C- XF3+ performs better in eliminating voiding when compared to any SAC-alloy. XF3+ paste provides improved print performance, as well as long stencil life. It also allows reflow without N2 and offers a high tack force/time.
Cobar 396-DRX, a new VOC-free flux, will be introduced at the show. This RoHS-compliant flux fulfils the need for more environmental-friendly materials, maintaining excellent soldering performance.
According to IPC-J-STD-004, the Cobar 396-DRX is classified as ORL0. It is halide and halogen free and is based on a water carrying system that provides advantages in transportation and storage conditions, and eliminates fire risks. Operators also will appreciate that it provides an odorless flux solution.
The thermally stable Cobar 396-DRX offers a wide process window with top-side preheat temperatures up to 150°C. Due to the strong thermal resistance, this flux can be used in a broad range of applications, such as high thermal mass and heavy multi-layer products that require extended and higher soldering conditions. The Cobar 396-DRX activation system eliminates bridging and provides excellent through-hole filling for lead-free as well as leaded applications.
Also available will be technical information regarding Cobar’s state-of-the art fluxes in formulations including alcohol-based, low-VOC, and VOC-free technology for use in lead-free and N2-free, SN100C-based wave and selective soldering processes.
