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FCT Assembly to Display Advanced Solder Pastes and Stencil Technology at SMTAI 2009

Sep 17, 2009

GREELEY, CO —FCT Assembly announces that it will debut four new solder pastes and showcase its breakthrough UltraSlic™ FG solder paste stencil in booth 417 at the upcoming SMTA International conference & exhibition, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.

The new pastes feature high-volume repeatability with 16 mm pitch QFP pads and 12 mm circles, as well as excellent response to one-hour pause, after two knead strokes at 35-65 percent RH. All pastes feature IPC 7095 Class III resistance to voiding using both straight ramp and soak reflow profiles.

NC670 no-clean solder paste offers excellent resistance to hot and cold slump, resulting in minimal bridging and excellent wetting characteristics on all pad finishes. The use of NC670 results in clear, minimal residue, bright, shiny tin/lead solder joints, and excellent solder spread on all common pad finishes. The no-clean paste is compatible with 63/37, 62/36/2 alloys with Type 3, 4 and 5 solder meshes. It is ideal for customers experiencing pin testability issues with their current vendor, and cosmetic residue issues with SMQ92J.

NL930 lead-free, no-clean solder paste features excellent solderability, enabling the process to handle the most difficult wetting requirements. It also improves stencil life and provides superior cosmetics, especially when using SN100C. NL930 is compatible with SN100C and SAC alloys with Type 3, 4 and 5 solder meshes. It is the ideal solution for cosmetic residue issues.

FCT’s WS159 water-soluble solder paste offers best in class solder spread and wetting. The paste offers better resistance to environmental conditions along with better stability than WS150. WS159 is engineered to work with 63/37, 62/36/2 alloys with Type 3, 4 and 5 solder meshes.

It is ideal for customers experiencing stencil life issues, post-cleaning residue/cosmetics issues, and cosmetic (shine) issues.

WS177 lead-free, water-soluble solder paste features best in class solder spread and wetting for lead-free solder pastes. It is compatible with SN100C and SN97C alloys with Type 3,4 and 5 solder meshes. It is ideal for customers experiencing stencil life issues, cosmetic (shine) issues and microcracks.

In addition to the new pastes, FCT will exhibit its UltraSlic™ FG solder paste stencil, which is the latest breakthrough in stencil technology. With superior paste release below surface area ratios of 0.5, UltraSlic™ FG outperforms all existing stencil technologies on the market today. Using the latest stencil laser technology and Datum Alloys’ new Fine Grain stencil material, exclusively distributed by Ed Fagan, Inc., UltraSlic™ FG stencils provide superior aperture registration, higher performance and lower cost compared to electroform, the option of step stencils, and the option of same day turnaround times.

About FCT Assembly

FCT Assembly was created after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder (both conventional 63/37 and SN100C® lead-free) bar. The assembly products are manufactured in the Greeley, Colo. plant and the stencils are manufactured in the Beaverton, Ore., Memphis, Tenn., and Greeley, Colo. facilities. The stencils can be fabricated by both laser cutting and chemical etch. The company also makes precision parts in its A-Laser division, which is located in Beaverton, Ore. For more information, visit http://www.fctassembly.com.

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