At the University of Queensland’s Industry Connect and Showcase Event on September 1, 2009, research titled “Inhibition of Cracking in Lead-Free Solder Joints” was sponsored by Nihon Superior. “The Influence of Ni Content on Cracking in IMC Reaction Layers between Sn-Cu-Ni Solders and Cu Substrates” was chosen by the Dean of the Faculty of Engineering, Architecture and Information Technology, Professor Graham Schaffer from the 40 or so projects on display as one of the best examples of a successful cooperation between the university and industry. This event, the first of its kind, was held in the grand hall of the historic 19th century Customs House overlooking the river in Queensland state capital of Brisbane.
Professor Schaffer made the point that the cooperation between the university and Nihon Superior had been mutually beneficial. The research had contributed significantly toward establishing the case for Nihon Superior’s unique patented SN100C tin-copper-nickel-germanium alloy as the best option for the electronics industry as it moves to lead-free solder. For the university, the project opened opportunities in an important area of materials science in which it had not previously been active.
As an example of the breakthroughs that had been achieved in the project, Professor Schaffer highlighted the recent discovery by Dr. Kazuhiro Nogita, the Principal Research Fellow in charge of the project, of the stabilization by nickel of the intermetallic phase that effects solder joint reliability.
The identification by Mr. Tetsuro Nishimura, president of Nihon Superior, of the importance of nickel in lead-free solder formulation was the basis on which the company’s successful global business was developed. However, not all aspects of the effect of this addition had been understood at the time the study of this alloy began at University of Queensland. Early work established the effect of the nickel addition on the solidification behavior of the SN100C alloy and work currently underway is elucidating the factors that affect the resistance of a solder joint to the impact loading that occurs when a portable device such as a mobile phone is accidentally dropped. This work is expected to further strengthen the position of SN100C in the increasingly competitive global market for lead-free solder.
For more information about Nihon Superior Co. Ltd., visit http://www.nihonsuperior.co.jp.
About Nihon Superior Co. Ltd.
Nihon Superior was founded in 1966 when it began marketing unique flux products imported from the US. The company made its mark on society by gathering the most advanced soldering and brazing technologies and products from around the world, and supplying them to companies in the metal-joining industry. A turning point for the company came when it started developing its own soldering materials and with the success of its unique SN100C lead-free solder alloy Nihon Superior has become a major player in the global market. To support the growing demand for its products Nihon Superior has established manufacturing and sales centers in Japan, China and other Asian countries and formed business partnerships with companies in other markets.