Quad Flat No-Lead (QFN) packages have gained wide scale acceptance and typically appear in densely populated boards where real estate is at a premium. As with all components, size and pitch continue to narrow, leaving traditional hand rework behind. The design, size and assembly process of QFNs present unique rework challenges not seen with other components. Neil’s presentation will focus on the complete rework process, including component removal, site preparation, component paste printing, and finally new component soldering. The stencil design and paste process will be looked at in depth and soldering results evaluated. Triple row QFNs will be the test case.
FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, Shanghai, China and Penang, Malaysia.