Kazuo Kawai, SMT Consultant for Hirox-USA and Seika Machinery, also will present a joint paper titled “Inspection to Improve Lead-Free Solder Technologies” during session PRC1.
Having capable and controllable assembly processes are essential elements that characterize successful electronics manufacturing companies. Why? High production yields result in low labor and scrap costs.
An assembly infrastructure that takes advantage of today’s automated inspection technologies assists in the goal of achieving best-in-class yields, as well as significantly reducing the labor costs associated with manual inspection. The key to process control is not to use these automated inspection tools reactively, but to use them proactively in real time — identifying a process trending toward an upper or lower specification limit, not waiting until a process goes out of control.
Micro packages such a 0201 and 01005s, lead-free solder, BGAs and other under-package I/O components all have confounded the inspection challenge. The papers in this session will document work that has been done to help meet these challenges.
About Seika Machinery, Inc.
Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.