Aug 31, 2009
CyberOptics redefines inspection speed with the SE500 — a new 100 percent 3-D solder paste inspection system. This system has the ability to inspect the most demanding assemblies with a >80 cm2/second inspection speed that does not compromise measurement accuracy and repeatability.
Building on CyberOptics’ reputation as the provider of solder paste inspection systems with industry-leading volume accuracy, the SE500 can inspect pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing line speeds.
The SE500 product line has two models that accommodate different panel sizes. The SE500 features a conveyor that can transport panels from 50 x 50 mm (2 x 2 in.) up to 510 x 510 mm (20 x 20 in.) The SE500X can transport panels from 100 x 100 mm (4 x 4 in.) up to 810 x 610 mm (32 x 24 in.).
Standard features for both models include automatic conveyor width adjustment, mechanical board stop, 1- and 2-D multiple barcode read using the sensor, and Process Tracker™ SPC charts with alarm capability in the Operator User Interface. Additionally, the SE500 has enhanced warp compensation for flexible circuits, the ability to handle odd-shaped pads, and an XML file format output for easy integration to shop floor control systems. The SE500 also can run program files originally created for the SE 300 Ultra.
Flex HR is an enhanced resolution AOI system with inspection performance for 01005 components and larger. As one of the highest-speed inspection systems in the industry, Flex HR is ideal for assembly lines producing a wide range of products including memory modules, notebooks PCs, mobile phones, automotive products and other industrial electronic assemblies.
Base system features include high-speed pre- and post-reflow inspection capabilities, patented SAM™ vision technology that learns as the process varies providing the lowest escape and false-call rate combination in the industry. This software also enables the ability to inspect any component or feature such as chips, ICs, empty locations, lead-free solder joints, gold fingers, connectors, clips and screws.
Recent system enhancements include assembly variant management, dual-stage defect review and repair, and Process TrackerTM SPC. The newly released Auto-Seeding feature will significantly simplify initial programming and greatly reduce fine tuning time.
The system also features the company’s easy-to-use operator user interface (OUI). The new OUI for inspection and defect review provides operators a simple, intuitive graphical user interface with a look and feel similar to the user interface on the CyberOptics SE 300 solder paste inspection machine.
About CyberOptics Corporation
Founded in 1984, CyberOptics is a recognized leader in process yield and throughput improvement solutions for the global electronics assembly and semiconductor capital equipment markets. Headquartered in Minneapolis, MN, CyberOptics conducts operations in North America, Asia and Europe. For more information, visit the company’s Web site at http://www.cyberoptics.com.
