SMT, PCB Electronics Industry News
  • SMTnet
  • »
  • Industry News
  • »
  • CyberOptics to Feature SE500™ 3-D SPI and Flex HR AOI at IPC Midwest 2009

CyberOptics to Feature SE500™ 3-D SPI and Flex HR AOI at IPC Midwest 2009

Aug 31, 2009

MINNEAPOLIS - September 2009 - CyberOptics Corporation (NASDAQ: CYBE), a leading provider of SMT inspection solutions, announces that it will exhibit its SE500™ 3-D Solder Paste Inspection, along with the Flex High-Resolution automated optical inspection system (AOI) in booth 301 at the upcoming IPC Midwest Conference & Exhibition, scheduled to take place September 23-24, 2009 at the Renaissance Schaumburg Hotel & Convention Center in Schaumburg, IL.

CyberOptics redefines inspection speed with the SE500 — a new 100 percent 3-D solder paste inspection system. This system has the ability to inspect the most demanding assemblies with a >80 cm2/second inspection speed that does not compromise measurement accuracy and repeatability.

Building on CyberOptics’ reputation as the provider of solder paste inspection systems with industry-leading volume accuracy, the SE500 can inspect pad sizes down to 01005 component size (150 x 150 µm) while keeping up with ever-increasing line speeds.

The SE500 product line has two models that accommodate different panel sizes. The SE500 features a conveyor that can transport panels from 50 x 50 mm (2 x 2 in.) up to 510 x 510 mm (20 x 20 in.) The SE500X can transport panels from 100 x 100 mm (4 x 4 in.) up to 810 x 610 mm (32 x 24 in.).

Standard features for both models include automatic conveyor width adjustment, mechanical board stop, 1- and 2-D multiple barcode read using the sensor, and Process Tracker™ SPC charts with alarm capability in the Operator User Interface. Additionally, the SE500 has enhanced warp compensation for flexible circuits, the ability to handle odd-shaped pads, and an XML file format output for easy integration to shop floor control systems. The SE500 also can run program files originally created for the SE 300 Ultra.

Flex HR is an enhanced resolution AOI system with inspection performance for 01005 components and larger. As one of the highest-speed inspection systems in the industry, Flex HR is ideal for assembly lines producing a wide range of products including memory modules, notebooks PCs, mobile phones, automotive products and other industrial electronic assemblies.

Base system features include high-speed pre- and post-reflow inspection capabilities, patented SAM™ vision technology that learns as the process varies providing the lowest escape and false-call rate combination in the industry. This software also enables the ability to inspect any component or feature such as chips, ICs, empty locations, lead-free solder joints, gold fingers, connectors, clips and screws.

Recent system enhancements include assembly variant management, dual-stage defect review and repair, and Process TrackerTM SPC. The newly released Auto-Seeding feature will significantly simplify initial programming and greatly reduce fine tuning time.

The system also features the company’s easy-to-use operator user interface (OUI). The new OUI for inspection and defect review provides operators a simple, intuitive graphical user interface with a look and feel similar to the user interface on the CyberOptics SE 300 solder paste inspection machine.

About CyberOptics Corporation

Founded in 1984, CyberOptics is a recognized leader in process yield and throughput improvement solutions for the global electronics assembly and semiconductor capital equipment markets. Headquartered in Minneapolis, MN, CyberOptics conducts operations in North America, Asia and Europe. For more information, visit the company’s Web site at http://www.cyberoptics.com.

May 03, 2010 -

CyberOptics Corporation Hires Daniel Good as Vice President of Corporate Development

Aug 31, 2009 -

CyberOptics to Feature SE500™ 3-D SPI and Flex HR AOI at IPC Midwest 2009

Sep 15, 2008 -

CyberOptics to Showcase Flex HR, Its High-Performance AOI System, at IPC Midwest 2008

Sep 12, 2008 -

CyberOptics to Feature SE 300 Ultra� 3-D Solder Paste Inspection at IPC Midwest 2008

Nov 15, 2007 -

CyberOptics Wins Global Technology Award for Its High-Resolution AOI System

Feb 10, 2003 -

CyberOptics Announces Date and Time of Fourth Quarter Earnings Conference Call

May 02, 2002 -

CyberOptics Acquires Manufacturing and Distribution Rights To Photonics Assembly Equipment

Feb 13, 2002 -

Post-Placement AOI Measurement for 0201's

Sep 24, 2017 -

Europlacer Shows Printer at Productronica India – Just!

Sep 24, 2017 -

Microtronic GmbH Appoints Distributor for the LBT210 & ConTTest Systems in Spain and Portugal

Sep 24, 2017 -

INTERFLUX® Electronics Completes Testing on New Alloy at Ersa Demo Room

Sep 24, 2017 -

CyberOptics Launches Coordinate Measurement Software Suite for New High Speed SQ3000™ CMM System

Sep 21, 2017 -

Logic PD Sponsoring, Exhibiting at American Medical Device 2017

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

See electronics manufacturing industry news »

CyberOptics to Feature SE500™ 3-D SPI and Flex HR AOI at IPC Midwest 2009 news release has been viewed 757 times

  • SMTnet
  • »
  • Industry News
  • »
  • CyberOptics to Feature SE500™ 3-D SPI and Flex HR AOI at IPC Midwest 2009

Facility Closure