SMT, PCB Electronics Industry News

Essemtec to Premier the PANFLEX2 At IPC Midwest 2009

Aug 28, 2009

Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will premier the PANFLEX2, a highly flexible high-speed pick-and-place machine in booth 704 at the upcoming IPC Midwest Conference & Exhibition, scheduled to take place September 23-24, 2009 at the Renaissance Schaumburg Hotel & Convention Center in Schaumburg, IL.

Numerous products, ranging from one to several tens of thousands, and increasing cost pressures are some of the challenges facing today’s electronics production. Essemtec has developed the new PANFLEX2 to specifically meet these production demands and challenges. The system places chips from 0201 to 50 x 50 mm fine-pitch QFPs.

The positioning of the electronic components is accomplished with quick laser optic and vision systems. Also, as a new feature and significant benefit, PANFLEX2 now comes with a standard vision system, which was developed by Essemtec to provide cost savings in addition to more component flexibility.

PANFLEX2 consists of two parallel operating placing modules that are connected via a multistage conveyor. Each module is responsible for part of placing, and together they achieve a capacity of 12,000 components per hour. The common transportation system is equipped with a SMEMA interface, providing easy connection to other machines at both the input and output.

Up to 190 various components can be prepared simultaneously. This significant receiving capacity enables the fabrication of very complex orders and reduces the time for adaption. For example, electronic components used at several orders can remain on the machine constantly.

Despite its great capacity, the PANFLEX2 is very compact because Essemtec is focused on machines with small foot prints and small, highly flexible feeders. These motorized, intelligent component-cassettes are quick and interchangeable during operation. They can be programmed offline by barcode reader and will be identified by the pick-and-place machine automatically.

Using the graphic user interface, operation is both quick and easy to learn. The same software is used in all Essemtec pick-and-place machines so that programs and libraries can be exchanged easily. With the universal CAD-interface coordinate lists, software can be changed into finished placement programs within seconds. With the integrated virtual-view function, these programs can be checked before placement with the actual printing board and can be corrected, if necessary.

PANFLEX2 is based on the technology of the successful FLX pick-and-place machine series. Feeders, programs and libraries are completely compatible. PANFLEX2 is developed and manufactured in Switzerland and offers high quality at both the product and service levels.

Together with system delivery, customers receive full access to the company’s remote maintenance system and to the customer portal Essemtec also offers attractive solutions for capital investment financing and service contracts.

All Essemtec equipment is optimized for maximum flexibility, providing users quick changeover from one product to another on the shop floor while simultaneously using the manufacturing capacity to its maximum. Essemtec – be more flexible.

Essemtec is a worldwide leader in the manufacturer of Surface Mount Technology (SMT) production equipment. Essemtec specializes in high mix production equipment for Printed Circuit Boards (PCB) using Surface Mount Technology. Essemtec is the only manufacturer to cover the entire production process, from Printers and/or Dispensers, to Pick-and-Place and Soldering equipment. Therefore, customers benefit from unparallel knowledge and the ability to select, from a single source, a complete process solution to meet their requirements.

Feb 21, 2017 -

Essemtec Wins the 2017 NPI Award for Multifunction Placement for the New FOX2

Jan 11, 2017 -

Essemtec Announces Placement & Jetting in a Single Pass Through with the New FOX2

Nov 21, 2016 -

Juerg Schuepbach Joins Essemtec as International Sales Manager

Oct 13, 2016 -

Essemtec's FOX Offers Hassle-Free Manufacturing of 2.5D Assemblies - Learn More at the Upcoming SMTA Expos

Sep 12, 2016 -

Essemtec Will Demonstrate the Spider Jet Dispenser at IMAPS 2016 in Pasadena

Sep 06, 2016 -

New Compact Pick-and-Place with Linear Motors to be Displayed at SMTA Guadalajara

May 31, 2016 -

Essemtec Brings on Captec to Back Continued Growth in Northern CA and NV

May 02, 2016 -

Bob Stevenson Joins Essemtec USA to Strengthen North American Reach

Feb 17, 2016 -

Essemtec Will Exhibit 3D Assembly and Jet Printing Solutions at APEX

Dec 08, 2015 -

Essemtec’s outstanding 3D jet printing and 3D assembly solutions created great attention at productronica 2015

184 more news from ESSEMTEC »

Jun 22, 2017 -

PNC Inc. Invests in LED Laser Direct Imaging system from Miva Technologies

Jun 22, 2017 -

Addressing The Modulation of Light Output -- High Quality LED Manufacturing

Jun 22, 2017 -

Schleuniger, Inc. Receives 2017 Best of Manchester Award

Jun 21, 2017 -

Inovar Inc. Breaks Ground for New Facility on USU Innovation Campus

Jun 21, 2017 -

PNC Inc. Launches Design Webinar Series

Jun 21, 2017 -

Saelig Introduces Mercury™ T2C USB 2.0 & Power Delivery Protocol Analyzer With Type-C Connection

Jun 20, 2017 -

Europlacer Secures Fourth Award from Industry Analysts Frost & Sullivan.

Jun 20, 2017 -

In Memory of Jim D. Raby, PE

Jun 20, 2017 -

Micro-Focused IR Thermal Testing with PDR's Focused IR

Jun 20, 2017 -

SCS to Present ‘Using Conformal Coatings to Mitigate System Failures’ during upcoming Webinar

See electronics manufacturing industry news »

Essemtec to Premier the PANFLEX2 At IPC Midwest 2009 news release has been viewed 661 times


PCB Cleaning