SMT, PCB Electronics Industry News

DEK Raises the Bar on DirEKt Coat™ Technology

Aug 10, 2009

Anticipating future requirements for high-volume wafer adhesive and coating applications, DEK has enhanced the process capability of its award-winning DirEKt Coat™ technology by a factor of three. With Cp>2@+/- 12.5µm and a 7µm Total Thickness Variation (TTV), DirEKt Coat wafer coating processes effectively address the needs of current and future thinned wafer products.

With the ability to deposit 25µm thick coatings onto wafers as thin as 150µm, the DirEKt Coat wafer backside coating technique enables faster processing times and chip footprint maximization. Traditional die attach adhesive processes such as dispensing, for example, have been unable to deliver the speeds in tandem with the deposit accuracy needed for today’s high-volume manufacturing requirements. Uneven adhesive coverage, chip footprint limitations due to resin bleed and fillet formation and slower, serial deposition speeds are inherent and well-known challenges with traditional die attach processes. DirEKt Coat, on the other hand, provides a parallel process on a proven print platform, depositing materials on wafers as large as 200mm in a single stroke and exponentially – by a factor of 10 – improving processing speeds. Additionally, bondline is controlled to customer specifications and the fillet is eliminated, affording a larger chip area for valuable functionality.

Key to the advance of DirEKt Coat’s process capability is DEK’s new Galaxy Thin Wafer System, which incorporates robust rails and precise transport technology to accommodate a newly engineered, next-generation wafer pallet. The pallet is designed of unique porous materials that ensure thinned wafers remain secure and stable while being imaged during any one of DEK’s proven semiconductor packaging processes. Flat to less than 10µm, the pallet is 400mm square and can accommodate wafers up to 300mm in diameter and as thin as 75µm. The exceptional flatness of the pallet and stability of the system allows the extended Cp and the remarkable 7µm TTV.

“In addition to the unyielding pace of product miniaturization and increased functionality, today’s economic climate is forcing packaging firms to get more out of their processes,” states David Foggie, DEK Semiconductor and Alternative Applications Manager. “Consistent with DEK’s ‘Expect More’ philosophy and technology leadership pledge, we have delivered with DirEKt Coat a future-capable process that offers better performance, improved reliability and faster processing speeds for thinned wafer applications -- all at a 30% lower material cost as compared to current film die attach products.”

It is important to note that enhancements to the DirEKt Coat wafer backside coating process do not come at the expense of any of its formerly well-established benefits, which include reduction of required paste adhesive volumes due to fillet elimination, the ability to pre-manufacture and store wafers until needed, and supply chain efficiency improvements resulting from the use of a single material for multiple requirements as opposed to sourcing film products of varying thicknesses and widths.

The Galaxy Thin Wafer System is capable of hosting a variety of other advanced semiconductor processes including, but not limited to, DirEKt Ball Placement™, thermal interface materials deposition, wafer bumping and encapsulation. Contact DEK to find out more.

About DEK

DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. For more information, visit DEK at http://www.dek.com.

Sep 06, 2017 -

Don't miss! ASM @ SMTAi 2017

Feb 28, 2014 -

Experience Unmatched Printing Knowledge and Future Technology Capability with DEK at APEX 2014

Mar 21, 2012 -

DEK Earns its Tenth Consecutive Service Excellence Award; Customers Consistently Impressed with Support

Feb 15, 2012 -

ProDEK Closed Loop Printing Technology Raises the Bar on Dynamic Process Control

Feb 15, 2012 -

ProDEK Closed Loop Printing Technology Raises the Bar on Dynamic Process Control

Jan 20, 2012 -

DEK signs contract with Ortana at Productronica 2011

Dec 21, 2011 -

Indium Corporation snaps up DEK Horizon 01iX at Productronica 2011

Dec 02, 2011 -

DEK and Interlatin Take Productivity on Tour to Overwhelming Response

Aug 03, 2011 -

Great Lakes Engineering Licenses DEK VectorGuard® Technology

Jul 22, 2011 -

DEK partners with OKI to introduce breakthrough technologies at first Advanced SMT Processes and Applications Seminar in Chengdu

132 more news from ASM Assembly Systems (DEK) »

Sep 21, 2017 -

Logic PD Sponsoring, Exhibiting at American Medical Device 2017

Sep 20, 2017 -

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Sep 20, 2017 -

COT Announces PB Swiss Tools’ Two New INSIDER Models: INSIDER STUBBY and INSIDER STUBBY RATCHET

Sep 20, 2017 -

New IPC Studies Show World PCB Market Up in 2016 as North American Market Shrinkage Slows World PCB Production and Annual North American PCB Industry Reports Released

Sep 20, 2017 -

ADLINK Technology invites clients to join the MEC Congress 2017

Sep 19, 2017 -

ASC International to Highlight 3D AOI/SPI Innovations at SMTA International

Sep 19, 2017 -

MicroCare Presents Radically Innovative ‘Greener’ Cleaning Fluid at Parts2Clean Stuttgart Hall 3 Stand A46

Sep 19, 2017 -

Aegis Software’s FactoryLogix a major step on Melecs journey towards Industry 4.0

Sep 19, 2017 -

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2018 in San Diego

Sep 19, 2017 -

SCS Webinar to Address the Use of Parylene for Increased Reliability

See electronics manufacturing industry news »

DEK Raises the Bar on DirEKt Coat™ Technology news release has been viewed 766 times

Facility Closure

Plasma Prior to Conformal Coating