"With 5 great tutorials, expert panel discussions, distinguished keynote speaker Dr. Rao Tummala, and 18 tech sessions featuring a new track on MEMS WL and WLP, this program will be one of the best sources for information on WLP, CSP, and 3D packaging this year." said Conference General Chair Dr. Ken Gilleo, ET-Trends LLC.
Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages. The event is sponsored by Dow Electronic Materials, Pac Tech USA, and Technic, Inc.
For more information on the IWLPC contact Melissa Serres Marx at 952-920-7682 or email@example.com.
Visit http://www.iwlpc.com to view the full program and to register.
The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.