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News from Seika Machinery, Inc.


Seika to Feature Product Literature for all Seika Machinery Products at SMTA Ohio

Jun 30, 2009

TORRANCE, CA — June 2009 — Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will feature product literature for all Seika products at the upcoming SMTA Ohio Expo & Tech Forum, scheduled to take place Wednesday, July 15, 2009 at the Doubletree Hotel in Cleveland, OH.

Tim Cappoen, Seika Machinery’s Atlanta Branch Office Manager, will be handing out literature on all Seika Machinery products. Featured new literature includes:

The Anritsu 3-D High Precision Laser In-Line Inspection System features numerous advanced technology features including ultra-high resolution: horizontal (10 µm/20 µm interchangeable) and vertical (1 µm, best in class), high-speed inspection (33 sq cm/sec at 20 µm resolution; 13.8 sq cm/sec at 10 µm resolution), and easy programming and maintenance in that program generation is accomplished in approximately five minutes and consistent results are provided, regardless of the operator.

Additionally, the system offers many benefits to users such as an automatic calibration function for easy maintenance, SPC software that is included as standard for detailed analysis and traceability, and reliable and accurate zero plane reference points.

For more information about the Anritsu 3-D High Precision Laser In-Line Inspection System or Seika’s full product line, visit Seika at the SMTA Ohio Expo & Tech Forum or visit http://www.seikausa.com.

About Seika Machinery, Inc.

Seika Machinery, Inc. (SMI) is a subsidiary of Seika Corporation, Japan and member of the Mitsubishi Global Group. SMI provides electronics manufacturers with advanced machinery, superior materials and engineering services.

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