The manual configuration of the Lambda will be on display, capable of sophisticated die-attach tasks, such as bonding of flip chips, MEMS, MOEMS and sensors on substrate sizes up to 180 x 136 mm. A significant feature of the manual configuration is the FA7 heating plate, which offers a 50 x 50 mm heating area, high ramp rate, excellent thermal conductivity, very low thermal expansion and optional heated inert gas integration.
Applications for the FINEPLACER® Lambda include eutectic soldering, Au/Sn soldering, thermo compression, thermo-/ultrasonic bonding, adhesive technologies, and MEMS/MOEMS placement.
FINETECH is a leading manufacturer of innovative rework and micro assembly equipment for the latest advanced packages. The modular design of the FINEPLACER® platform enables a multitude of applications, from reworking SMDs to the highly accurate placement of flip chips or opto-electronic components. FINETECH is headquartered in Berlin, Germany, with offices in Tempe, Arizona, Shanghai, China and Penang, Malaysia.