The Pan Pacific Microelectronics Symposium focuses on the critical business markets and technologies of microelectronic packaging, interconnection, microsystems technology and assembly. The Program Committee invites you to submit your recent results for presentation at the Symposium on any of the topics listed below.
Papers should be 6-10 pages in length including graphics, and they should offer non-commercial research results on any of the topics listed above. Abstracts of 500 words should be submitted by July 31, 2009, with title and author contact information. Press the button below to submit your abstract directly to the SMTA server, where the Pan Pacific Technical Committee will have access to review your information.
Please be sure to obtain permission to write your paper, as well as attend the symposium, BEFORE submitting your abstract.