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Constantly high level of line productivity and automatic adaptation to new products with the SIPLACE X-Series powered by the SIPLACE MultiStar CPP head

May 29, 2009

SIPLACE reference lines equipped with the new MultiStar CPP head deliver a continuous high level of line productivity, especially in high-mix production environments.

The new head also enables manufacturers to reduce their placement costs per board by more than 30 percent. To achieve optimum placement performance, SMT lines previously had to be manually reconfigured and rebalanced for each product by adjusting the number and order of placement heads and machine positions. With its SIPLACE X-Series and the SIPLACE MultiStar CPP head, technology leader SIPLACE is introducing a new and exceptionally innovative concept.

For the first time, electronics manufacturers can install a line with an �allround� placement head that is able to manufacture 98 percent of all products. Depending on the requirements, the new placement head selects the optimum placement mode for the high-speed placement of small components or the flexible placement of complex components.

The benefit for electronics manufacturers is astounding because the new SIPLACE MultiStar CPP head eliminates the need for the time-consuming reconfiguration of placement heads, and the lines balance themselves automatically for each product and version change for optimum placement performance.

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