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New development from the SIPLACE Technology Network - The new SIPLACE CA application: Die-bonding and SMD placement in a single machine

May 29, 2009

Technology leader Siemens Electronics Assembly Systems (SEAS) unveils the new combined die-bonding and SMD placement application SIPLACE CA. Based on the SIPLACE X-series platform, it is the world's first machine that combines the highest of SMD placement speed with the extreme precision of die-bonding.

The new SIPLACE CA was developed by the SIPLACE Technology Network in close cooperation between the SIPLACE team and leading makers of electronic components. It processes dies (both flip-chip and die-attach) directly from the wafer, but it can also place conventional SMT components with the proven quality and speed of all SIPLACE X-Series machines.

The new SIPLACE CA provides electronics manufacturers not only with more flexibility for their customer specific application, but it significantly reduces the overall process cost of ownership compared with traditional systems. With the SIPLACE CA, users need to invest only in a single production line instead of two lines for either die-bonding or SMD placement. This reduces their investment, space costs and operational costs considerably.

More: You find the complete text and pictures in 300 dpi at: http://www.siplace.com (at News Center/Press Center /Press News).

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