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FCT Assembly Introduces WS177 Lead-Free, Water-Soluble Solder Paste

May 20, 2009

GREELEY, CO �FCT Assembly introduces WS177 lead-free water-soluble solder paste featuring its latest technology in print and reflow of paste in the water-soluble category for lead-free alloys.

WS177 lead-free, water-soluble solder paste features best in class solder spread and wetting for lead-free solder pastes, and IPC 7095 Class III resistance to voiding using both straight ramp and soak reflow profiles. WS177 is fully cleanable after two paste reflow cycles, with the widest cleaning process window in its class.

WS177 is compatible with SN100C and SN97C alloys with Type 3,4 and 5 solder meshes. It is ideal for customers experiencing stencil life issues, cosmetic (shine) issues, cosmetic (shine, microcracks), and boards with OSP, ENIG, Immersion Silver, and Immersion Tin finishes.

WS177 delivers complete removal of flux residue, bright, shiny SN100C solder joints, and excellent solder spread on all common pad finishes. It also provides excellent post-reflow yields and best in class after exposure to extreme humidity conditions.

WS177 features high-volume repeatability with 16 mm pitch QFP pads and 12 mm circles, as well as excellent response to one-hour pause, after two knead strokes at 35-65 percent RH.

About FCT Assembly

FCT Assembly was created after the purchase of Fine Line Stencil, Inc., and consists of two major operations: stencil manufacturing and the manufacturing of electronic assembly products such as solder paste, flux and solder (both conventional 63/37 and SN100C� lead-free) bar. The assembly products are manufactured in the Greeley, Colo. plant and the stencils are manufactured in the Beaverton, Ore., Memphis, Tenn., and Greeley, Colo. facilities. The stencils can be fabricated by both laser cutting and chemical etch. The company also makes precision parts in its A-Laser division, which is located in Beaverton, Ore. For more information, visit http://www.fctassembly.com.

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