Dr. Lee's paper focuses the effect of additions of manganese or cerium on the reliability ( test and thermal cycling) of traditional and lead-free (tin/silver/copper) solder alloys. tests and thermal cycling replicate harsh usage of electronics products to ensure finished goods reliability. The paper will be presented on May 29th as part of session 22: Lead-Free solder.
The professional development course will explore the detailed material considerations required for achieving high reliability in lead-free solder joints. Topics include: understanding factors related to various failure modes, and how to select proper solder alloys and surface finishes. The course will be presented at the morning session on May 26th.
Sponsored by the IEEE's Components, Packaging and Manufacturing Technology Society (CPMT), and the Electronic Components Association (ECA), ECTC focuses on the electronics industry, including electronic components, materials assembly, packaging, system packaging, and optoelectronics, as well as emerging technologies.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research covers advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.
Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner and registered to ISO-9001.